Integrated micro-channel heatsink in DMD substrate for enhanced cooling capacity

Patent metadata

Field	Value
Publication number	US-9971147-B2
Application number	US-201615275633-A
Country	US
Kind code	B2
Filing date	Sep 26, 2016
Priority date	Sep 26, 2016
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

A DMD cooling apparatus and method includes a DMD chip configured on a substrate, and a heatsink located within and integrated into the substrate upon which the DMD is configured. A plurality of micro-channels can be formed on a backside of the substrate. The micro-channels are fabricated via microlithography in association with a fabrication of the DMD chip such that the heatsink integrated into the silicon substrate allows for direct heat removal from the substrate.

First claim

What is claimed is:

1. A DMD cooling apparatus, comprising:
a DMD configured on a silicon substrate, said DMD including a mirror array located below a glass cover;
a heatsink located within and integrated into said substrate upon which said DMD is configured, and wherein said heatsink comprises an integrated heatsink located inside a DMD chip that comprises said DMD; and
a plurality of micro-channels in a micro-channel cooling arrangement configured on a backside of said substrate, said heatsink comprising said plurality of micro-channels through which a cooling fluid flows for cooling of said DMD wherein said plurality of micro-channels is fabricated in association with a fabrication of said DMD such that said heatsink is integrated into said substrate and allows for direct heat removal from said substrate and wherein a pre-heat beam from at least one LDA (Laser Diode Array) pre-heats said substrate to a specified temperature before an imaging beam from at least one imaging LDA writes on said substrate and wherein a laser output from said at least one LDA or said at least one imaging LDA is directed to a substrate coated with a photochromatic ink wherein each pixel on said substrate coated with said photochromatic ink responds in a gradient to an amount of energy applied by said laser output.

2. The apparatus of claim 1 wherein said cooling fluid comprises water.

3. The apparatus of claim 1 wherein said DMD comprises a housing and an inlet port and outlet port formed from said housing.

4. The apparatus of claim 3 wherein said housing comprises an alumina housing.

5. The apparatus of claim 3 wherein a fluid path for said cooling fluid is formed between said inlet port and said outlet port.

6. The apparatus of claim 5 wherein said fluid path for said cooling fluid comprises said plurality of micro-channels.

7. The apparatus of claim 5 further comprising an epoxy seal that contains cooling fluid disposed on an underside of said substrate so that none of said cooling fluid interferes with mirrors on an upper surface of said DMD.

8. A DMD cooling apparatus, comprising:
a DMD configured on a substrate, wherein said DMD comprises a housing and an inlet port and outlet port formed from said housing, said DMD including a mirror array located below a glass cover;
a heatsink located within and integrated into said substrate upon which said DMD is configured, and wherein said heatsink comprises an integrated heatsink located inside a DMD chip that comprises said DMD; and
a plurality of micro-channels in a micro-channel cooling arrangement configured on a backside of said substrate, said heatsink comprising said plurality of micro-channels through which a cooling fluid flows for cooling of said DMD wherein said plurality of micro-channels is fabricated via microlithography in association with a fabrication of said DMD such that said heatsink is integrated into said substrate and allows for direct heat removal from said substrate and wherein a pre-heat beam from at least one LDA (Laser Diode Array) pre-heats said substrate to a specified temperature before an imaging beam from at least one imaging LDA writes on said substrate and wherein a laser output from said at least one LDA or said at least one imaging LDA is directed to a substrate coated with a photochromatic ink wherein each pixel on said substrate coated with said photochromatic ink responds in a gradient to an amount of energy applied by said laser output.

9. The apparatus of claim 8 wherein said cooling fluid comprises water.

10. The apparatus of claim 8 wherein said housing comprises an alumina housing and wherein said cooling fluid comprises water.

11. The apparatus of claim 8 wherein a fluid path of said cooling fluid is formed between said inlet port and said outlet port.

12. The apparatus of claim 11 wherein said fluid path comprises said plurality of micro-channels and further comprises an epoxy seal that contains cooling fluid disposed on an underside of said substrate so that none of said cooling fluid interferes with mirrors on an upper surface of said DMD.

13. A method of fabricating a DMD cooling apparatus, comprising:
configuring a DMD on a silicon substrate;
configuring said DMD to include a mirror array located below a glass cover;
locating a heatsink within and integrated into said substrate upon which said DMD is configured, and wherein said heatsink comprises an integrated heatsink located inside a DMD chip that comprises said DMD; and
configuring a plurality of micro-channels in a micro-channel cooling arrangement on a backside of said substrate, such that said heatsink is configured to comprise said plurality of micro-channels through which a cooling fluid flows for cooling of said DMD;
configuring said plurality of micro-channels in association with a fabrication of said DMD such that said heatsink is integrated into said substrate and allows for direct heat removal from said substrate and wherein a pre-heat beam from at least one LDA (Laser Diode Array) pre-heats said substrate to a specified temperature before an imaging beam from at least one imaging LDA writes on said substrate and wherein a laser output from said at least one LDA or said at least one imaging LDA is directed to a substrate coated with a photochromatic ink wherein each pixel on said substrate coated with said photochromatic ink responds in a gradient to an amount of energy applied by said laser output.

14. The method of claim 13 further comprising configuring said plurality of micro-channels via microlithography in association with said fabrication of said DMD and wherein said cooling fluid comprises water.

15. The method of claim 14 further comprising:
configuring said DMD to include a housing; and
forming an inlet port and outlet port from said housing.

16. The method of claim 15 further comprising forming a fluid path for said cooling fluid between said inlet port and said outlet port.

17. The method of claim 16 wherein said fluid path comprises said plurality of micro-channels.

18. The method of claim 16 further comprising providing an epoxy seal that contains cooling fluid disposed on an underside of said substrate so that none of said cooling fluid interferes with mirrors on an upper surface of said DMD.

19. The method of claim 15 wherein said substrate comprises silicon and wherein said housing comprises an alumina housing.

Assignees

• Xerox Corp

Inventors

• Atwood Christopher D
• Adiletta Mark A
• Dergham Ali R
• Leighton Roger G
• Zirilli Francisco

Classifications

• G02B26/0833 Primary

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• B81C1/00333

  Aspects relating to packaging of MEMS devices, not covered by groups B81C1/00269 - B81C1/00325 · CPC title

• B81B7/0067

  for controlling the passage of optical signals through the package · CPC title

• G03F7/70891 Primary

  Temperature · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title