Electro-optic device, eletro-optic unit, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9933615-B2
Application number	US-201715468804-A
Country	US
Kind code	B2
Filing date	Mar 24, 2017
Priority date	Mar 29, 2016
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

An electro-optic device includes an interconnection board provided with an internal terminal, and a chip mounted on the interconnection board, and the chip is provided with a mirror, a drive element, and a chip-side terminal electrically connected to the drive element. The interconnection board includes a first surface on which an internal terminal is disposed, a second surface located on an opposite side to the first surface, a third surface connecting the first surface and the second surface to each other, and a fourth surface located on an opposite side to the third surface. The interconnection board is provided with a metal member exposed on the first surface and the second surface, and through holes (a first through hole and a second through hole) extending from the third surface to the fourth surface and having contact with the metal member.

First claim

What is claimed is:

1. An electro-optic device comprising:
an interconnection board provided with a first surface on which a first terminal is disposed, a second surface located on an opposite side to the first surface, a third surface connected to the second surface, and a fourth surface located on an opposite side to the third surface;
a chip mounted on the first surface, and provided with a mirror, a drive element adapted to drive the mirror, and a second terminal electrically connected to the drive element; and
a conductive member adapted to connect the first terminal and the second terminal to each other,
wherein the interconnection board is provided with a metal member disposed between the first surface and the second surface, and exposed on the first surface and the second surface, and a first through hole extending from the third surface to the fourth surface, and having contact with the metal member.

2. The electro-optic device according to claim 1 , wherein
the interconnection board is provided with a second through hole extending from the third surface to the fourth surface, and having contact with the metal member from an opposite side to a side from which the first through hole has contact with the metal member.

3. The electro-optic device according to claim 1 , wherein
the chip is located so as to overlap the metal member.

4. The electro-optic device according to claim 3 , wherein
the chip has contact with the metal member directly or via an adhesive layer.

5. The electro-optic device according to claim 1 , wherein
the interconnection board includes a third terminal disposed on the second surface, and an interconnection part adapted to connect the first terminal and the third terminal to each other between the first surface and the second surface.

6. The electro-optic device according to claim 5 , wherein
the plurality of first terminals and the plurality of third terminals are each arranged from the third surface toward the fourth surface.

7. An electro-optic unit comprising:
the electro-optic device according to claim 1 ; and
a blower adapted to feed air toward the third surface.

8. An electronic apparatus comprising:
the electro-optic device according to claim 1 ; and
a light source section adapted to irradiate the mirror with source light.

Assignees

• Seiko Epson Corp

Inventors

• Uchiyama Suguru
• Takahashi Kosuke

Classifications

• G03B21/008

  using micromirror devices · CPC title

• G02B26/0833 Primary

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• G02B26/0841 Primary

  the reflecting element being moved or deformed by electrostatic means · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title

• B81B7/0093

  by cooling · CPC title