Electro-optic device, electro-optic unit, and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9933614-B2
Application number	US-201715467036-A
Country	US
Kind code	B2
Filing date	Mar 23, 2017
Priority date	Mar 29, 2016
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

An electro-optic device includes a chip provided with a mirror and a drive element adapted to drive the mirror, a light-transmitting cover adapted to cover the mirror in a planar view, and a spacer having contact with one surface of the chip between the cover and the chip. The entire part of one surface of the chip having contact with the spacer is made of a first material such as silicon oxide film having first thermal conductivity, and the spacer is made of a second material such as a quartz crystal having second thermal conductivity higher than the first thermal conductivity. The cover is made of a third material such as sapphire having third thermal conductivity higher than the second thermal conductivity.

First claim

What is claimed is:

1. An electro-optic device comprising:
a chip provided with a mirror and a drive element adapted to drive the mirror;
a light-transmitting cover adapted to cover the mirror in a planar view; and
a spacer located between the cover and the chip, and having contact with one surface of the chip,
wherein an entire part of the one surface having contact with the spacer is made of a first material having first thermal conductivity, and
the spacer is made of a second material having second thermal conductivity higher than the first thermal conductivity.

2. The electro-optic device according to claim 1 , further comprising:
a sealing material adapted to cover an entire side surface of the spacer and an entire side surface of the cover.

3. The electro-optic device according to claim 1 , wherein
the cover is made of a third material having third thermal conductivity higher than the second thermal conductivity.

4. The electro-optic device according to claim 1 , wherein
the cover is made of a third material having third thermal conductivity lower than the second thermal conductivity.

5. The electro-optic device according to claim 1 , wherein
the spacer and the cover are made of a same material.

6. An electro-optic unit comprising:
the electro-optic device according to claim 1 ; and
a blower adapted to supply air to the electro-optic device.

7. An electronic apparatus comprising:
the electro-optic device according to claim 1 ; and
a light source section adapted to irradiate the mirror with source light.

Assignees

• Seiko Epson Corp

Inventors

• Uchiyama Suguru
• Takahashi Kosuke

Classifications

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W76/12

  characterised by their shape · CPC title

• H10W74/121

  by multiple encapsulations, e.g. by a thin protective coating and a thick encapsulation · CPC title