Assembly body for micromirror chips, mirror device and production method for a mirror device

Patent metadata

Field	Value
Publication number	US-10012828-B2
Application number	US-201515307433-A
Country	US
Kind code	B2
Filing date	Apr 27, 2015
Priority date	May 7, 2014
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

An assembly body for micromirror chips that partly encloses an internal cavity, the assembly body including at two sides oriented away from one another, at least one respective partial outer wall that is fashioned transparent for a specified spectrum, and the assembly body having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, in such a way that a light beam passing through the first partial outer wall is capable of being deflected by the first micromirror chip onto the second micromirror chip, and is capable of being deflected by the second micromirror chip through the second partial outer wall. A mirror device and a production method for a mirror device are also described.

First claim

What is claimed is:

1. An assembly body for micromirror chips partially enclosing an internal cavity, the assembly body comprising:
at two sides of the assembly body oriented away from one another, a respective partial outer wall that is made transparent for a specified spectrum;
at least one first outer opening on which a first micromirror chip can be attached; and
a second outer opening on which a second micromirror chip can be attached;
wherein the assembly body is configured in such a way that a light beam passing through a first partial outer wall of the two partial outer walls is capable of being deflected by the first micromirror chip attached on the first outer opening, onto the second micromirror chip attached on the second outer opening, and is capable of being deflected by the second micromirror chip attached on the second outer opening through a second partial outer wall of the two partial outer walls.

2. The assembly body as recited in claim 1 , wherein the assembly body includes a first cuboidal wall having the first partial outer wall fashioned thereon, a second cuboidal wall having the second partial outer wall fashioned thereon, and an intermediate frame situated between the first cuboidal wall and the second cuboidal wall.

3. The assembly body as recited in claim 2 , wherein at least one of the first cuboidal wall and the second cuboidal wall is formed completely of at least one material transparent for the specified spectrum.

4. The assembly body as recited in claim 2 , wherein the first outer opening is fashioned on the second cuboidal wall and the second outer opening is fashioned on the first cuboidal wall.

5. The assembly body as recited in claim 1 , wherein the assembly body has a hollow profile on which the first partial outer wall and the second partial outer wall are fashioned, and which frames the internal cavity extending from the first outer opening to the second outer opening.

6. The assembly body as recited in claim 5 , wherein the hollow profile is an oblique hollow profile.

7. The assembly body as recited in claim 5 , wherein the hollow profile is formed completely of at least one material transparent for the specified spectrum.

8. The assembly body as recited in claim 1 , wherein the assembly body includes at least one externally situated contacting unit.

9. A mirror device, comprising:
an assembly body for micromirror chips partially enclosing an internal cavity, the assembly body having, at two sides of the assembly body oriented away from one another, a respective partial outer wall that is made transparent for a specified spectrum, the assembly further having at least one first outer opening on which a first micromirror chip can be attached, and a second outer opening on which a second micromirror chip can be attached, wherein the assembly body is configured in such a way that a light beam passing through a first partial outer wall of the two partial outer walls is capable of being deflected by the first micromirror chip attached on the first outer opening, onto the second micromirror chip attached on the second outer opening, and is capable of being deflected by the second micromirror chip attached on the second outer opening through a second partial outer wall of the two partial outer walls;
the first micromirror chip attached on the first outer opening of the assembly body; and
the second micromirror chip attached on the second outer opening of the assembly body.

10. A production method for a mirror device, comprising:
forming an assembly body that partly encloses an internal cavity, the assembly body having, at two sides oriented away from one another, a respective partial outer wall that is transparent for a specified spectrum, and the assembly body being fashioned having at least one first outer opening and having a second outer opening; and
attaching a first micromirror chip on the first outer opening and of a second micromirror chip on the second outer opening;
wherein the fashioning of the first outer opening and of the second outer opening and the attaching of the first micromirror chip and of the second micromirror chip take place in such a way that when there is an operation of the mirror device, a light beam passing through a first partial outer wall of the two partial outer walls is deflected by the first micromirror chip onto the second micromirror chip, and is deflected by the second micromirror chip through a second partial outer wall of the two partial outer walls.

Assignees

• Bosch Gmbh Robert

Inventors

• Schatz Frank
• Heuck Friedjof
• Doessel Kerrin
• Pinter Stefan
• Pantel Daniel
• Rohlfing Franziska

Classifications

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title

• B81B7/0067 Primary

  for controlling the passage of optical signals through the package · CPC title

• G02B26/0833 Primary

  the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD (G02B26/0825 takes precedence; micromechanical devices in general B81B) · CPC title

• G02B27/0006

  with means to keep optical surfaces clean, e.g. by preventing or removing dirt, stains, contamination, condensation (G02B1/18 takes precedence; cleaning in general B08B) · CPC title

• G02B26/101

  with both horizontal and vertical deflecting means, e.g. raster or XY scanners (colour television using laser beams scanning a display screen H04N9/3129) · CPC title