Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
US-10518387-B2 · Dec 31, 2019 · US
Lapping tools
Lapping tools · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B24B37/11 |
| Official title | Lapping tools |
| Display label | Lapping tools |
| Total patents | 186 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 2 |
| 2016 | 18 |
| 2017 | 13 |
| 2018 | 14 |
| 2019 | 17 |
| 2020 | 23 |
| 2021 | 17 |
| 2022 | 29 |
| 2023 | 19 |
| 2024 | 17 |
| 2025 | 15 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Pad conditioner with spacer and wafer planarization system
US-2019337119-A1 · Nov 7, 2019 · US
Molds and methods to control mold surface quality
US-2019330096-A1 · Oct 31, 2019 · US
Polishing tool and polishing method for member having curved surface shape
US-10434622-B2 · Oct 8, 2019 · US
Flattening method and flattening apparatus
US-2019228994-A1 · Jul 25, 2019 · US
Molds and methods to control mold surface quality
US-10351459-B2 · Jul 16, 2019 · US
Polishing head for face-up type polishing apparatus, polishing apparatus including the polishing head, and polishing method using the polishing apparatus
US-2019210187-A1 · Jul 11, 2019 · US
Polishing head and polishing apparatus
US-2019184519-A1 · Jun 20, 2019 · US
Polishing head, CMP apparatus including a polishing head, and manufacturing method of semiconductor integrated circuit device using a CMP apparatus
US-10300577-B2 · May 28, 2019 · US
Flattening method and flattening apparatus
US-10297475-B2 · May 21, 2019 · US
Polishing pad having arc-shaped configuration
US-2019047110-A1 · Feb 14, 2019 · US
Chemical mechanical polishing slurry, method for chemical mechanical polishing and manufacturing method of semiconductor structure
US-10204793-B2 · Feb 12, 2019 · US
Grinding element, grinding wheel and manufacturing method of semiconductor package using the same
US-2019022827-A1 · Jan 24, 2019 · US
Surface modified abrasive particles, abrasive articles and methods of forming thereof
US-2018369991-A1 · Dec 27, 2018 · US
Buffing apparatus and substrate processing apparatus
US-10131030-B2 · Nov 20, 2018 · US
Polishing apparatus
US-10124462-B2 · Nov 13, 2018 · US
Polishing head, CMP apparatus having polishing head, and semiconductor integrated circuit manufacturing method using CMP apparatus
US-10118273-B2 · Nov 6, 2018 · US
Polishing pad configuration and polishing pad support
US-10105812-B2 · Oct 23, 2018 · US
Polishing apparatus, polishing head, and retainer ring
US-10092992-B2 · Oct 9, 2018 · US
Method for Manufacturing of a Rotor
US-2018236577-A1 · Aug 23, 2018 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B24B37/11?
- CPC B24B37/11 is the Cooperative Patent Classification code for “Lapping tools.”
- How many patents are filed under CPC B24B37/11 (Lapping tools)?
- Our database includes 186 publications tagged with this CPC code.
- Is patent activity under CPC B24B37/11 growing?
- Publication counts under this code: 17 in 2024 vs 15 in 2025 (latest complete years).