Polishing pad configuration and polishing pad support

Patent metadata

Field	Value
Publication number	US-10105812-B2
Application number	US-201514801630-A
Country	US
Kind code	B2
Filing date	Jul 16, 2015
Priority date	Jul 17, 2014
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

Chemical mechanical polishing can be used for “touch-up polishing” in which polishing is performed on a limited area of the front surface of the substrate. The contact area between the polishing pad and the substrate can be substantially smaller than the radius surface of the substrate. During polishing, the polishing pad can undergo an orbital motion. The polishing pad can be maintained in a fixed angular orientation during the orbital motion. The contact area can be arc-shaped. The contact area can be provided by one or more lower portions projecting downward from an upper portion of the polishing pad. A perimeter portion of the polishing pad can be vertically fixed to an annular member and a remainder of the polishing pad within the perimeter portion can be vertically free.

First claim

What is claimed is:

1. A polishing assembly, comprising:
a polishing pad support, the polishing pad support including a base that has an annular member and a recess with a substrate-facing opening;
a polishing pad held by the pad support, the polishing pad having a polishing surface to contact a substrate during polishing, wherein a perimeter portion of the polishing pad is vertically fixed to the annular member and a remainder of the polishing pad within the perimeter portion is vertically free; and wherein the substrate-facing opening of the polishing pad support is sealed by the polishing pad to define a first pressurizable chamber to provide a first adjustable pressure on a first portion of a back surface of the polishing pad; and
a membrane secured to the base within the recess such that a volume between the base and the membrane defines a second pressurizable chamber and an outer surface of the membrane contacts the back surface of the polishing pad in a second portion and is separated from the back surface of polishing pad in the first portion such that the membrane provides a second adjustable pressure on the second portion of the back surface of the polishing pad.

2. The polishing assembly of claim 1 , comprising an adhesive securing the perimeter portion of the polishing pad to the annular member.

3. The polishing assembly of claim 1 , comprising one or more clamps holding the perimeter portion of the polishing pad on the annular member.

4. The polishing assembly of claim 1 , wherein the membrane and second pressurizable chamber are configured such that a pressure in the second pressurizable chamber controls a lateral size of a loading area of the polishing surface against a substrate.

5. The polishing assembly of claim 1 , wherein the polishing pad includes a first section having the polishing surface and a second section that is flexible and extends laterally from the first section.

6. The polishing assembly of claim 1 , wherein the perimeter portion of the polishing pad has a plurality of apertures to receive projections from the pad support.

7. The polishing assembly of claim 6 , wherein the plurality of apertures are positioned at corners of the polishing pad.

8. The polishing assembly of claim 7 , wherein the polishing pad is rectangular.

9. The polishing assembly of claim 1 , wherein the polishing pad includes an upper portion that extends across the substrate-facing opening and is secured to the annular member to seal the first pressurizable chamber, and a lower portion projecting downward from the upper portion, a bottom surface of the lower portion providing the polishing surface, and wherein the lower portion has a second lateral dimension that is less than a first lateral dimension of the upper portion such that the upper portion projects past all lateral sides of the lower portion.

10. The polishing assembly of claim 9 , and wherein a total surface area of the polishing surface from the lower portions is no more than 10% of a surface area of the upper portion.

11. The polishing assembly of claim 9 , further comprising a plurality of grooves for slurry transport on the polishing surface of the lower portion of the polishing pad.

Assignees

• Applied Materials Inc

Inventors

• Chen Hung Chih

Classifications

• H10P95/06

  Planarisation of inorganic insulating materials · CPC title

• H10P95/04

  Planarisation of conductive or resistive materials · CPC title

• H10P52/403

  of conductive or resistive materials · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• H10W20/062

  by smoothing of conductive parts, e.g. by planarisation · CPC title