Molds and methods to control mold surface quality

US10351459B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10351459-B2
Application numberUS-201615234114-A
CountryUS
Kind codeB2
Filing dateAug 11, 2016
Priority dateAug 14, 2015
Publication dateJul 16, 2019
Grant dateJul 16, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (R a ) less than or equal to about 0.15 μm and a waviness height (W a ) less than or equal to about 100 nm. A mold for shaping glass-based material can include a mold body having an outer metal surface, wherein the outer metal surface has an average surface roughness (R a ) less than or equal to about 0.15 μm and a waviness height (W a ) less than or equal to about 100 nm.

First claim

Opening claim text (preview).

We claim: 1. A mold comprising: a mold body having a metal surface; and a metal oxide layer on the metal surface of the mold body, wherein: the metal oxide layer has first and second opposing surfaces, the first surface of the metal oxide layer contacts and faces the metal surface of the mold body, the second surface of the metal oxide layer includes a plurality of grains, and the plurality of grains has an average grain size of about 300 μm or less. 2. The mold of claim 1 , wherein the second surface includes at least one grain body area and at least one grain boundary area and wherein an average height differential between the at least one grain body area and the at least one grain boundary area is about 2 μm or less. 3. The mold of claim 2 , wherein the average height differential is about 1 μm or less. 4. The mold of claim 1 , wherein the average grain size is about 150 μm or less. 5. The mold of claim 1 , wherein the second surface of the metal oxide layer has a waviness (Wa) of less than or equal to about 500 nm. 6. The mold of claim 5 , wherein the second surface of the metal oxide layer has a waviness (Wa) of less than or equal to about 100 nm. 7. The mold of claim 1 , wherein the second surface of the metal oxide layer has an average surface roughness (Ra) of about 1 μm or less. 8. The mold of claim 7 , wherein the second surface of the metal oxide layer has an average surface roughness (Ra) of about 0.4 μm or less. 9. The mold of claim 8 , wherein the second surface of the metal oxide layer has an average surface roughness (Ra) in a range from about 0.2 μm to about 0.4 μm. 10. The mold of claim 1 , wherein the second surface of the metal oxide layer has a waviness (Wa) of less than or equal to about 500 nm and an average surface roughness (Ra) of about 1 μm or less. 11. The mold of claim 1 , wherein the second surface of the metal oxide layer has a waviness (Wa) of less than or equal to about 500 nm and an average surface roughness (Ra) in a range from about 0.2 μm to about 0.4 μm. 12. The mold of claim 1 , wherein a ratio of an R volume below the surface of the metal oxide layer divided by the R volume above the surface of the metal oxide layer is less than or equal to 2. 13. The mold of claim 1 , wherein the mold body comprises: at least 90% nickel by weight; and at least one of titanium, aluminum, zirconium, silicon, manganese, or cerium, wherein a sum of a weight percent of titanium, aluminum, zirconium, silicon, manganese and cerium is in a range from about 0.6% to about 1%. 14. The mold of claim 13 , wherein the mold body comprises at least 99% nickel by weight. 15. The mold of claim 13 , wherein the metal oxide layer is nickel oxide.

Assignees

Inventors

Classifications

  • C03B23/03Primary

    by press-bending between shaping moulds · CPC title

  • containing rare earths · CPC title

  • B24B19/26Primary

    for grinding workpieces with arcuate surfaces, e.g. parts of car bodies, bumpers or magnetic recording heads (grinding of spherical surfaces in general B24B11/00, of optical surfaces on lenses or surfaces of similar shape on other work B24B13/00) · CPC title

  • Oxide ceramics · CPC title

  • containing zinc or zirconium · CPC title

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What does patent US10351459B2 cover?
A method for treating a mold includes grinding an outer metal surface of a mold body of the mold with a first material; lapping the outer metal surface after the grinding with a second material that is finer than the first material; and polishing the outer metal surface after the lapping to achieve an average surface roughness (R a ) less than or equal to about 0.15 μm and a waviness height (W …
Who is the assignee on this patent?
Corning Inc
What technology area does this patent fall under?
Primary CPC classification C03B23/03. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jul 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).