Polishing tool and polishing method for member having curved surface shape

US10434622B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10434622-B2
Application numberUS-201515504772-A
CountryUS
Kind codeB2
Filing dateJul 30, 2015
Priority dateAug 27, 2014
Publication dateOct 8, 2019
Grant dateOct 8, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.

First claim

Opening claim text (preview).

The invention claimed is: 1. A polishing method comprising: polishing a resin-coated surface having a curved surface by using a polishing pad having a polishing surface formed of a hard resin layer, the polishing pad having a radius smaller than each of dimensions of the resin-coated surface in a plurality of directions along the resin-coated surface, wherein the polishing surface is allowed to follow the resin-coated surface by forming the polishing pad to include a two-layer structure which includes the hard resin layer and a soft resin layer that supports the hard resin layer, and a hardness of the soft resin layer is 30 degrees or less in terms of E hardness defiled in conformity with JIS K 6253. 2. The polishing method according to claim 1 , comprising allowing the polishing surface to follow the resin-coated surface by forming a groove on the polishing surface. 3. The polishing method according to claim 1 , wherein pressing force of the polishing surface against the resin-coated surface is constant. 4. The polishing method according to claim 1 , comprising polishing the resin-coated surface by using a second polishing pad of which hardness is lower than hardness of the hard resin layer, after the resin-coated surface is polished by the polishing pad. 5. The polishing method according to claim 1 , comprising using slurry containing alumina abrasive grains as a polishing agent.

Assignees

Inventors

Classifications

  • Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title

  • characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

  • B24B37/22Primary

    characterised by a multi-layered structure · CPC title

  • Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents (polishing tools in general B24D13/00) · CPC title

  • Lapping tools · CPC title

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What does patent US10434622B2 cover?
A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.
Who is the assignee on this patent?
Fujimi Inc
What technology area does this patent fall under?
Primary CPC classification B24B37/22. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Oct 08 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).