Polishing cushion, polishing apparatus, polishing method, and article including object polished by the polishing method
US-2016303708-A1 · Oct 20, 2016 · US
US10434622B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10434622-B2 |
| Application number | US-201515504772-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 30, 2015 |
| Priority date | Aug 27, 2014 |
| Publication date | Oct 8, 2019 |
| Grant date | Oct 8, 2019 |
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A polishing method capable of removing waviness on a resin-coated surface having a curved surface is provided. The resin-coated surface having the curved surface is polished by using a polishing pad having a polishing surface formed of a hard resin layer.
Opening claim text (preview).
The invention claimed is: 1. A polishing method comprising: polishing a resin-coated surface having a curved surface by using a polishing pad having a polishing surface formed of a hard resin layer, the polishing pad having a radius smaller than each of dimensions of the resin-coated surface in a plurality of directions along the resin-coated surface, wherein the polishing surface is allowed to follow the resin-coated surface by forming the polishing pad to include a two-layer structure which includes the hard resin layer and a soft resin layer that supports the hard resin layer, and a hardness of the soft resin layer is 30 degrees or less in terms of E hardness defiled in conformity with JIS K 6253. 2. The polishing method according to claim 1 , comprising allowing the polishing surface to follow the resin-coated surface by forming a groove on the polishing surface. 3. The polishing method according to claim 1 , wherein pressing force of the polishing surface against the resin-coated surface is constant. 4. The polishing method according to claim 1 , comprising polishing the resin-coated surface by using a second polishing pad of which hardness is lower than hardness of the hard resin layer, after the resin-coated surface is polished by the polishing pad. 5. The polishing method according to claim 1 , comprising using slurry containing alumina abrasive grains as a polishing agent.
Lapping machines or devices; Accessories (B24B3/00 takes precedence) · CPC title
characterised by the shape of the lapping pad surface, e.g. grooved · CPC title
characterised by a multi-layered structure · CPC title
Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents (polishing tools in general B24D13/00) · CPC title
Lapping tools · CPC title
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