Flux, solder paste and solder joint
US-10160064-B2 · Dec 25, 2018 · US
Carboxylic acids or salts
Carboxylic acids or salts · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/3618 |
| Official title | {Carboxylic acids or salts} |
| Display label | Carboxylic acids or salts |
| Total patents | 171 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 17 |
| 2017 | 20 |
| 2018 | 18 |
| 2019 | 7 |
| 2020 | 11 |
| 2021 | 12 |
| 2022 | 20 |
| 2023 | 18 |
| 2024 | 12 |
| 2025 | 17 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonding method using bonding material
US-10090275-B2 · Oct 2, 2018 · US
Metal paste and use thereof for joining components
US-2018147673-A1 · May 31, 2018 · US
Use of dynamic cross-linked polymer compositions in soldering applications
US-2018118875-A1 · May 3, 2018 · US
Solder alloy, solder paste, and electronic circuit board
US-9956649-B2 · May 1, 2018 · US
Solder alloy, solder composition, solder paste, and electronic circuit board
US-9931716-B2 · Apr 3, 2018 · US
Flux composition containing carbon component, solder paste containing the same, and soldering method
US-2018056422-A1 · Mar 1, 2018 · US
Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device
US-2018029169-A1 · Feb 1, 2018 · US
Lead-free solder alloy
US-9844837-B2 · Dec 19, 2017 · US
Flux composition
US-9844839-B2 · Dec 19, 2017 · US
Flux composition and techniques for use thereof
US-9815149-B2 · Nov 14, 2017 · US
Enhanced cleaning for water-soluble flux soldering
US-9818717-B2 · Nov 14, 2017 · US
Rosin-free thermosetting flux formulations
US-9802275-B2 · Oct 31, 2017 · US
Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
US-9803111-B2 · Oct 31, 2017 · US
Lead-free solder paste
US-9770786-B2 · Sep 26, 2017 · US
Thermally decomposable polymer compositions for forming microelectronic assemblies
US-9757818-B2 · Sep 12, 2017 · US
Flux formulations
US-9751159-B2 · Sep 5, 2017 · US
Enhanced cleaning for water-soluble flux soldering
US-2017243852-A1 · Aug 24, 2017 · US
Metal composition, bonding material
US-2017173739-A1 · Jun 22, 2017 · US
Solder flux
US-2017157717-A1 · Jun 8, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/3618?
- CPC B23K35/3618 is the Cooperative Patent Classification code for “Carboxylic acids or salts.”
- How many patents are filed under CPC B23K35/3618 (Carboxylic acids or salts)?
- Our database includes 171 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/3618 growing?
- Publication counts under this code: 12 in 2024 vs 17 in 2025 (latest complete years).