Solder alloy, solder paste, and electronic circuit board
US-9221132-B2 · Dec 29, 2015 · US
Lead-free solder alloy
US9844837B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9844837-B2 |
| Application number | US-201214006538-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 23, 2012 |
| Priority date | Mar 23, 2011 |
| Publication date | Dec 19, 2017 |
| Grant date | Dec 19, 2017 |
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Abstract
Official abstract text for this publication.
By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as inside a vehicle heated by the sun or in a low-temperature environment such as outdoors in snowy weather.
First claim
Opening claim text (preview).
The invention claimed is: 1. A lead-free solder alloy consisting of 0.2-1.0 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-2.0 mass % of Bi, 0.02-0.5 mass % of Sb, 0.01-0.3 mass % of In, and a remainder of Sn, wherein the mass % of Bi is at least 4 times greater than the mass % of In. 2. A lead-free solder paste in which a solder powder of the lead-free solder alloy according to claim 1 is mixed with a flux, wherein the flux contains a total of at least 0.5 mass % and less than 5.0 mass % of at least one organic acid selected from the group consisting of succinic acid, adipic acid, and azelaic acid. 3. A flux-cored solder comprising a solder wire of the lead-free solder alloy according to claim 1 , having its center filled with a flux, wherein the flux contains at least one organic acid selected from the group consisting of succinic acid, adipic acid, and azelaic acid. 4. A solder ball made from the lead-free solder alloy according to claim 1 . 5. A solder preform made from the lead-free solder alloy according to claim 1 .
Assignees
Inventors
Classifications
- B23K35/26Primary
with the principal constituent melting at less than 400°C · CPC title
Electricity · mapped topic
Powders, particles or spheres; Preforms made therefrom · CPC title
Electricity · mapped topic
Pastes, creams or slurries · CPC title
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- What does patent US9844837B2 cover?
- By using a solder alloy consisting essentially of 0.2-1.2 mass % of Ag, 0.6-0.9 mass % of Cu, 1.2-3.0 mass % of Bi, 0.02-1.0 mass % of Sb, 0.01-2.0 mass % of In, and a remainder of Sn, it is possible to obtain portable devices having excellent resistance to drop impact and excellent heat cycle properties without developing thermal fatigue even when used in a high-temperature environment such as…
- Who is the assignee on this patent?
- Shimamura Masato, Ohnishi Tsukasa, Kosai Mitsuhiro, and 8 more
- What technology area does this patent fall under?
- Primary CPC classification B23K35/26. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Dec 19 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).