Flux, solder paste and solder joint

Patent metadata

Field	Value
Publication number	US-10160064-B2
Application number	US-201314911515-A
Country	US
Kind code	B2
Filing date	Aug 12, 2013
Priority date	Aug 12, 2013
Publication date	Dec 25, 2018
Grant date	Dec 25, 2018

Abstract

A purpose of the present invention is to provide a flux having an improved cleaning property by suppressing a carbonization of a flux residue. A flux contains an organic acid, a thixotropic agent, rosin and a solvent wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent. The fatty acid monoethanol amide is added in an amount of 3-10% by weight as the thixotropic agent. In addition, a dicarboxylic acid having 10 or less carbon atoms is added in an amount of 4-10% by weight as the organic acid. Moreover, the solvent is added in an amount of 30-60% by weight.

First claim

The invention claimed is:

1. A flux, comprising:
an organic acid;
a thixotropic agent;
rosin; and
a solvent
wherein a fatty acid monoalkylol amide having 14-20 carbon atoms is contained as the thixotropic agent.

2. The flux according to claim 1 , wherein one of a palmitic acid monoethanol amide and a stearic acid monoethanol amide or both of the palmitic acid monoethanol amide and the stearic acid monoethanol amide are added as the fatty acid monoalkylol amide in an amount of 3-10% by weight.

3. The flux according to claim 2 , wherein a dicarboxylic acid having 10 or less carbon atoms is added as the organic acid in an amount of 4-10% by weight.

4. The flux according to claim 2 , wherein the solvent is added in an amount of 30-60% by weight.

5. A solder paste, comprising a mixture of the flux recited in claim 1 and solder alloy powder.

6. The flux according to claim 3 , wherein the solvent is added in an amount of 30-60% by weight.

7. A solder paste, comprising a mixture of the flux recited in claim 2 and solder alloy powder.

8. A solder paste, comprising a mixture of the flux recited in claim 3 and solder alloy powder.

9. A solder paste, comprising a mixture of the flux recited in claim 4 and solder alloy powder.

10. A solder joint formed by using the solder paste recited in claim 5 .

11. A solder joint formed by using the solder paste recited in claim 7 .

12. A solder joint formed by using the solder paste recited in claim 8 .

13. A solder joint formed by using the solder paste recited in claim 9 .

Assignees

• Senju Metal Industry Co

Inventors

• Mori Hideki
• Kitazawa Kazuya

Classifications

• B23K35/0222

  for use in soldering or brazing (B23K35/0205 takes precedence) · CPC title

• B23K35/36

  Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title

• B23K35/3613

  Polymers, e.g. resins · CPC title

• B23K35/0244

  Powders, particles or spheres; Preforms made therefrom · CPC title

• B23K35/362 Primary

  Selection of compositions of fluxes (B23K35/365, B23K35/368 take precedence) · CPC title