Conductive structure body precursor, conductive structure body and method for manufacturing the same
US-2015370359-A1 · Dec 24, 2015 · US
Bonding method using bonding material
US10090275B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10090275-B2 |
| Application number | US-201514966585-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 11, 2015 |
| Priority date | Mar 15, 2010 |
| Publication date | Oct 2, 2018 |
| Grant date | Oct 2, 2018 |
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- Title
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Abstract
Official abstract text for this publication.
A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
First claim
Opening claim text (preview).
The invention claimed is: 1. A method of bonding two different substances, comprising: applying a bonding material to a bonding surface of a bonding substrate, the bonding material containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and a flux component that includes an organic material having at least two carboxyl groups; disposing an object to be bonded on the bonding material; performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed; and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing to metallize the bonding material. 2. The bonding method according to claim 1 , wherein the flux component has an ether bond. 3. The bonding method according to claim 2 , wherein, in the preliminary firing and main firing, bonding is performed in an inert gas atmosphere. 4. The bonding method according to claim 3 , wherein the main firing is carried out at a temperature of 200° C. or higher and 500° C. or lower. 5. The bonding method according to claim 2 , wherein the main firing is carried out at a temperature of 200° C. or higher and 500° C. or lower. 6. The bonding method according to claim 1 , wherein, in the preliminary firing and main firing, bonding is performed in an inert gas atmosphere. 7. The bonding method according to claim 6 , wherein the main firing is carried out at a temperature of 200° C. or higher and 500° C. or lower. 8. The bonding method according to claim 1 , wherein the main firing is carried out at a temperature of 200° C. or higher and 500° C. or lower.
Assignees
Inventors
Classifications
between stacked chips · CPC title
of die-attach connectors · CPC title
Controlling the bonding environment, e.g. atmosphere composition or temperature · CPC title
Soldering or alloying · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
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- What does patent US10090275B2 cover?
- A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is di…
- Who is the assignee on this patent?
- Dowa Electronics Materials Co Ltd
- What technology area does this patent fall under?
- Primary CPC classification H01B1/02. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 02 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).