Solder alloy, solder paste, and electronic circuit board
US-9445508-B2 · Sep 13, 2016 · US
Solder alloy, solder composition, solder paste, and electronic circuit board
US9931716B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9931716-B2 |
| Application number | US-201414442628-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 28, 2014 |
| Priority date | Jun 24, 2014 |
| Publication date | Apr 3, 2018 |
| Grant date | Apr 3, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is above 6.2 mass % and 10 mass % or less; and the content ratio of the tin is the remaining ratio.
First claim
Opening claim text (preview).
The invention claimed is: 1. A solder alloy consisting of: tin, silver, copper, bismuth, nickel, cobalt, and indium, and optionally antimony, wherein with respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is 6.3 mass % or more and 10 mass % or less; the content ratio of antimony, when present, being 0.4 mass % or more and 10 mass % or less; and the content ratio of the tin is the remaining ratio, and wherein the solder alloy satisfies 1) a crack resistance ranking of A or B, wherein ranking A corresponds to A: a size of an observed maximum structure is less than 50 μm and ranking B corresponds to B: a size of an observed maximum structure is 50 μm or more and 100 μm or less; 2) a durability ranking of A or B, wherein ranking A corresponds to A: a crack completely crossing a solder fillet portion does not occur until 2500 cycles and ranking B corresponds to B: a crack completely crossing a solder fillet portion occurs between 1501 and 2500 cycles; 3) a breakage of component ranking of A, wherein ranking A corresponds to A: a crack does not occur in a chip component. 2. A solder alloy consisting of: tin, silver, copper, bismuth, nickel, cobalt, indium, and antimony, wherein with respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more and 4.8 mass % or less; the content ratio of the nickel is 0.01 mass % or more and 0.15 mass % or less; the content ratio of the cobalt is 0.001 mass % or more and 0.008 mass % or less; the content ratio of the indium is 6.3 mass % or more and 10 mass % or less; the content ratio of antimony is 0.4 mass % or more and 10 mass % or less; and the content ratio of the tin is the remaining ratio, and wherein the solder alloy satisfies 1) a crack resistance ranking of A or B, wherein ranking A corresponds to A: a size of an observed maximum structure is less than 50 μm and ranking B corresponds to B: a size of an observed maximum structure is 50 μm or more and 100 μm or less; 2) a durability ranking of A or B, wherein ranking A corresponds to A: a crack completely crossing a solder fillet portion does not occur until 2500 cycles and ranking B corresponds to B: a crack completely crossing a solder fillet portion occurs between 1501 and 2500 cycles; 3) a breakage of component ranking of A, wherein ranking A corresponds to A: a crack does not occur in a chip component.
Assignees
Inventors
Classifications
Application of solder · CPC title
Polymers, e.g. resins · CPC title
Operations & Transport · mapped topic
Carboxylic acids or salts · CPC title
Halogen compounds · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9931716B2 cover?
- A solder alloy is a tin-silver-copper solder alloy substantially consisting of tin, silver, copper, bismuth, nickel, cobalt, and indium. With respect to the total amount of the solder alloy, the content ratio of the silver is 2 mass % or more and 5 mass % or less; the content ratio of the copper is 0.1 mass % or more and 1 mass % or less; the content ratio of the bismuth is 0.5 mass % or more a…
- Who is the assignee on this patent?
- Harima Chemicals Inc
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 03 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).