Solder paste
US-12459060-B2 · Nov 4, 2025 · US
Pb as the principal constituent
Pb as the principal constituent · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/268 |
| Official title | {Pb as the principal constituent} |
| Display label | Pb as the principal constituent |
| Total patents | 48 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 6 |
| 2016 | 1 |
| 2017 | 13 |
| 2018 | 5 |
| 2019 | 4 |
| 2020 | 4 |
| 2021 | 4 |
| 2022 | 2 |
| 2023 | 3 |
| 2024 | 2 |
| 2025 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder material and method for die attachment
US-12388042-B2 · Aug 12, 2025 · US
Barrier-type photovoltaic welding strip capable of reducing damp-heat attenuation
US-12364026-B2 · Jul 15, 2025 · US
Copper-ceramic bonded substrate and method for manufacturing the same
US-2025185158-A1 · Jun 5, 2025 · US
Solder particles
US-12172240-B2 · Dec 24, 2024 · US
Solder material and method for die attachment
US-2024021565-A1 · Jan 18, 2024 · US
Solder material and method for die attachment
US-11842974-B2 · Dec 12, 2023 · US
Passive quench protection techniques for non-insulated superconducting magnets
US-2023146164-A1 · May 11, 2023 · US
Barrier-type photovoltaic welding strip capable of reducing damp-heat attenuation
US-2023131984-A1 · Apr 27, 2023 · US
Solder paste
US-2022331916-A1 · Oct 20, 2022 · US
Soldering a conductor to an aluminum metallization
US-11450642-B2 · Sep 20, 2022 · US
Solder particles
US-2021114145-A1 · Apr 22, 2021 · US
Soldering a conductor to an aluminum metallization
US-2021118843-A1 · Apr 22, 2021 · US
Soldering a conductor to an aluminum metallization
US-10896893-B2 · Jan 19, 2021 · US
Soldering a conductor to an aluminum metallization
US-10892247-B2 · Jan 12, 2021 · US
Soldering a conductor to an aluminum metallization
US-2020243480-A1 · Jul 30, 2020 · US
Soldering a conductor to an aluminum metallization
US-2020219841-A1 · Jul 9, 2020 · US
Solder material and method for die attachment
US-2020203304-A1 · Jun 25, 2020 · US
Soldering a conductor to an aluminum metallization
US-10615145-B2 · Apr 7, 2020 · US
Coated solder material and method for producing same
US-10512988-B2 · Dec 24, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/268?
- CPC B23K35/268 is the Cooperative Patent Classification code for “Pb as the principal constituent.”
- How many patents are filed under CPC B23K35/268 (Pb as the principal constituent)?
- Our database includes 48 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/268 growing?
- Publication counts under this code: 2 in 2024 vs 4 in 2025 (latest complete years).