Solder material and method for die attachment

Patent metadata

Field	Value
Publication number	US-12388042-B2
Application number	US-202318370150-A
Country	US
Kind code	B2
Filing date	Sep 19, 2023
Priority date	May 12, 2017
Publication date	Aug 12, 2025
Grant date	Aug 12, 2025

Abstract

A solder material comprising a solder alloy and a thermal conductivity modifying component. The solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K and is usable in enhancing the thermal conductivity of the solder, allowing for optimal heat transfer and reliability in electronic packaging applications.

First claim

What is claimed is:

1. A solder material comprising:
a solder, and
a thermal conductivity modifying component, the thermal conductivity modifying component being in the form of a wire,

wherein:
the solder material has a bulk thermal conductivity of between about 75 and about 150 W/m-K,
the solder material is in the form of a solder preform,
the solder comprises tin,
the thermal conductivity modifying component comprises tin plated copper, and
the solder material comprises between about 40 wt. % and about 90 wt. % of the solder and about 60 wt. % to about 10 wt. % of the thermal conductivity modifying component.

2. The solder material according to claim 1 , wherein the wire comprises a plurality of wires that are used in parallel and the parallel wires are packed close together.

3. The solder material according to claim 1 , wherein the wire is embedded in the solder.

4. The solder material according to claim 1 , wherein the solder has a thermal conductivity of between about 20 and about 70 W/m-K.

5. The solder material according to claim 1 , wherein the solder has a thermal conductivity of between about 19 and about 80 W/m-K.

6. The solder material according to claim 1 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 100 W/m-K.

7. The solder material according to claim 6 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 200 W/m-K.

8. The solder material according to claim 7 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 300 W/m-K.

9. The solder material according to claim 8 , wherein the thermal conductivity modifying component has a thermal conductivity of at least 400 W/m-K.

10. The solder material according to claim 1 , wherein the solder material has a bulk thermal conductivity of between about 80 and about 110 W/m-K.

11. The solder material according to claim 1 , wherein the diameter of the wire is greater than 5 microns, greater than 25 microns, or greater than 50 microns.

12. A solder joint comprising the solder material of claim 1 .

13. The solder joint according to claim 12 , wherein the solder joint is rectangular and the wire is oriented parallel to a shorter dimension of the rectangular solder joint, wherein the wires create a shorter path for gases to escape.

14. A method of making a solder joint between a substrate and a component, the method comprising:
applying the solder material of claim 1 to a substrate;
disposing a component on the solder material; and
reflowing the solder material to create the solder joint between the substrate and the component.

15. The method of claim 14 , wherein reflowing the solder material is carried out in a vacuum oven.

Assignees

• Alpha Assembly Solutions Inc

Inventors

• Gulino Angelo
• Bankiewicz Bogdan
• Khaselev Oscar
• Lifton Anna
• Marczi Michael T
• Sidone Girard
• Salerno Paul
• Koep Paul J

Classifications

• H10W72/555

  of outermost layers of multilayered bond wires, e.g. material of a coating · CPC title

• H10W72/5524

  comprising aluminium [Al] · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/351

  Materials of die-attach connectors · CPC title