Solder paste

Patent metadata

Field	Value
Publication number	US-12459060-B2
Application number	US-202017641012-A
Country	US
Kind code	B2
Filing date	Aug 28, 2020
Priority date	Oct 4, 2019
Publication date	Nov 4, 2025
Grant date	Nov 4, 2025

Abstract

A solder paste includes a solder powder and a flux. The flux includes a rosin, an activator, a solvent, and a thixotropic agent containing a polyethylene glycol. A content of the polyethylene glycol is 10 mass % to 20 mass % with respect to a total mass of the flux, a content of the thixotropic agent excluding the polyethylene glycol is 5 mass % or less with respect to the total mass of the flux, and a content of the rosin is more than 15 mass % and 50 mass % or less with respect to the total mass of the flux.

First claim

The invention claimed is:

1 . A solder paste, comprising:
a solder powder; and a flux comprising a rosin, an activator, a solvent and a thixotropic agent containing a polyethylene glycol, wherein the solder powder has a melting point of 280° C. or higher, a content of the polyethylene glycol is 10 mass % to 20 mass % with respect to a total mass of the flux, a content of the thixotropic agent excluding the polyethylene glycol is 5 mass % or less with respect to the total mass of the flux, a content of the rosin is 35 mass % or more and 50 mass % or less with respect to the total mass of the flux, a content of the solvent is 35 mass % or more with respect to the total mass of the flux, the solvent consists of at least one component selected from the group consisting of an alcohol-based solvent, an ester-based solvent, a glycol ether-based solvent, and a terpineol, the alcohol-based solvent is selected from the group consisting of isopropyl alcohol, 1,2-butanediol, isobornyl cyclohexanol, 2,4-diethyl-1,5-pentanediol, 2,2-dimethyl-1,3-propanediol, 2,5-dimethyl-2,5-hexanediol, 2,5-dimethyl-3-hexyne-2,5-diol, 2,3-dimethyl-2,3-butanediol, 1,1,1-tris(hydroxymethyl) ethane, 2-ethyl-2-hydroxymethyl-1,3-propanediol, 2,2′-oxybis(methylene)bis(2-ethyl-1,3-propanediol), 2,2-bis(hydroxymethyl)-1,3-propanediol, 1,2,6-trihydroxyhexane, bis[2,2,2-tris(hydroxymethyl)ethyl]ether, 1-ethynyl-1-cyclohexanol, 1,4-cyclohexanediol, 1,4-cyclohexanedimethanol, erythritol, threitol, guaiacol glycerol ether, 3,6-dimethyl-4-octyne-3,6-diol, and 2,4,7,9-tetramethyl-5-decyne-4,7-diol, the ester-based solvent is selected from the group consisting of diisobutyl succinate, dibutyl succinate, dimethyl adipate, diethyl adipate, dibutyl adipate, diisopropyl adipate, diisobutyl adipate, diisodecyl adipate, dibutyl maleate, dimethyl sebacate, diethyl sebacate, dibutyl sebacate, dioctyl sebacate, and diisopropyl sebacate, and the glycol ether-based solvent is selected from the group consisting of diethylene glycol mono-2-ethylhexyl ether, ethylene glycol monophenyl ether, 2-methylpentane-2,4-diol, diethylene glycol monohexyl ether, diethylene glycol dibutyl ether, triethylene glycol monobutyl ether, 1,3-butylene glycol, phenyl glycol, and hexylene glycol, and the rosin comprises one or more components selected from the group consisting of:
a gum rosin, a wood rosin, a tall oil rosin,
a purified gum rosin, a purified wood rosin, a purified tall oil rosin,
a hydrogenated gum rosin, a hydrogenated wood rosin, a hydrogenated tall oil rosin,
a disproportionated gum rosin, a disproportionated wood rosin, a disproportionated tall oil rosin,
a polymerized gum rosin, a polymerized wood rosin, a polymerized tall oil rosin,
an acrylic gum rosin, an acrylic wood rosin, an acrylic tall oil rosin,
a maleated gum rosin, a maleated wood rosin, a maleated tall oil rosin,
a fumarated gum rosin, a fumarated wood rosin, a fumarated tall oil rosin,
a purified product of the polymerized gum rosin, a purified product of the polymerized wood rosin, a purified product of the polymerized tall oil rosin,
a hydride of the polymerized gum rosin, a hydride of the polymerized wood rosin, a hydride of the polymerized tall oil rosin,
a disproportionated product of the polymerized gum rosin, a disproportionated product of the polymerized wood rosin, a disproportionated product of the polymerized tall oil rosin,
a purified product of the acrylic gum rosin, a purified product of the acrylic wood rosin, a purified product of the acrylic tall oil rosin,
a hydride of the acrylic gum rosin, a hydride of the acrylic wood rosin, a hydride of the acrylic tall oil rosin,
a disproportionated product of the acrylic gum rosin, a disproportionated product of the acrylic wood rosin, a disproportionated product of the acrylic tall oil rosin,
a purified product of the maleated gum rosin, a purified product of the maleated wood rosin, a purified product of the maleated tall oil rosin,
a hydride of the maleated gum rosin, a hydride of the maleated wood rosin, a hydride of the maleated tall oil rosin,
a disproportionated product of the maleated gum rosin, a disproportionated product of the maleated wood rosin, a disproportionated product of the maleated tall oil rosin,
a purified product of the fumarated gum rosin, a purified product of the fumarated wood rosin, a purified product of the fumarated tall oil rosin,
a hydride of the fumarated gum rosin, a hydride of the fumarated wood rosin, a hydride of the fumarated tall oil rosin, and
a disproportionated product of the fumarated gum rosin, a disproportionated product of the fumarated wood rosin, and a disproportionated product of the fumarated tall oil rosin.

2 . The solder paste according to claim 1 ,
wherein the polyethylene glycol is solid at room temperature.

3 . The solder paste according to claim 1 ,
wherein the rosin comprises two or more selected from the group consisting of:
a gum rosin, a wood rosin, a tall oil rosin,
a purified gum rosin, a purified wood rosin, a purified tall oil rosin,
a hydrogenated gum rosin, a hydrogenated wood rosin, a hydrogenated tall oil rosin,
a disproportionated gum rosin, a disproportionated wood rosin, a disproportionated tall oil rosin,
a polymerized gum rosin, a polymerized wood rosin, a polymerized tall oil rosin,
an acrylic gum rosin, an acrylic wood rosin, an acrylic tall oil rosin,
a maleated gum rosin, a maleated wood rosin, a maleated tall oil rosin,
a fumarated gum rosin, a fumarated wood rosin, a fumarated tall oil rosin,
a purified product of the polymerized gum rosin, a purified product of the polymerized wood rosin, a purified product of the polymerized tall oil rosin,
a hydride of the polymerized gum rosin, a hydride of the polymerized wood rosin, a hydride of the polymerized tall oil rosin,
a disproportionated product of the polymerized gum rosin, a disproportionated product of the polymerized wood rosin, a disproportionated product of the polymerized tall oil rosin,
a purified product of the acrylic gum rosin, a purified product of the acrylic wood rosin, a purified product of the acrylic tall oil rosin,
a hydride of the acrylic gum rosin, a hydride of the acrylic wood rosin, a hydride of the acrylic tall oil rosin,
a disproportionated product of the acrylic gum rosin, a disproportionated product of the acrylic wood rosin, a disproportionated product of the acrylic tall oil rosin,
a purified product of the maleated gum rosin, a purified product of the maleated wood rosin, a purified product of the maleated tall oil rosin,
a hydride of the maleated gum rosin, a hydride of the maleated wood rosin, a hydride of the maleated tall oil rosin,
a disproportionated product of the maleated gum rosin, a disproportionated product of the maleated wood rosin, a disproportionated product of the maleated tall oil rosin,
a purified product of the fumarated gum rosin, a purified product of the fumarated wood rosin, a purified product of the fumarated tall oil rosin,
a hydride of the fumarated gum rosin, a hydride of the fumarated wood rosin, a hydride of the fumarated tall oil rosin, and
a disproportionated product of the fumarated gum rosin, a disproportionated product of the fumarated wood rosin, and a disproportionated product of the fumarated tall oil rosin.

4 . The solder paste according to claim 1 , wherein
the polyethylene glycol is liquid in a temperature range of 240° C. or higher.

5 . The solder paste according to claim 1 , wherein
the polyethylene glycol has a boiling point of 300° C. or higher.

6 . The solder paste according to claim 1 , wherein
the polyethylene glycol has a molecular weight of 2700 to 3400.

7 . The solder paste according to claim 1 , wherein
the conten

Assignees

• Senju Metal Industry Co

Inventors

• UKAI Ryuji
• Ohta Kengo
• OKADA Sakie
• Kitazawa Kazuya

Classifications

• B23K35/3601

  with inorganic compounds as principal constituents · CPC title

• B23K35/025

  Pastes, creams or slurries · CPC title

• B23K35/36

  Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title

• B23K35/268

  Pb as the principal constituent · CPC title

• B23K35/262

  Sn as the principal constituent · CPC title