Barrier-type photovoltaic welding strip capable of reducing damp-heat attenuation

Patent metadata

Field	Value
Publication number	US-12364026-B2
Application number	US-202017926477-A
Country	US
Kind code	B2
Filing date	Jun 10, 2020
Priority date	May 20, 2020
Publication date	Jul 15, 2025
Grant date	Jul 15, 2025

Abstract

Disclosed is a barrier-type photovoltaic solder strip capable of reducing damp-heat (DH) attenuation, the photovoltaic solder strip comprising a photovoltaic solder strip body. A moisture barrier layer is arranged on a surface of the photovoltaic solder strip body that is not in contact with an electrode of a solar cell, and the moisture barrier layer can prevent external water and gas from entering the photovoltaic solder strip body, thus, on the basis of low cost, corrosion of the photovoltaic solder strip body by acidic substances, oxidizing agents and water in a module is reduced, thereby reducing attenuation of a photovoltaic module in a DH environment.

First claim

What is claimed is:

1. A barrier-type photovoltaic solder strip for a photovoltaic module comprising at least one solar cell, wherein the barrier-type photovoltaic solder strip is capable of reducing damp-heat (DH) attenuation and comprises a photovoltaic solder strip body and a moisture barrier layer provided on a surface of the photovoltaic solder strip body that is not to be in contact with an electrode of the at least one solar cell,
wherein a material of the moisture barrier layer comprises tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (THV) with a mass percentage in a range of 20% to 55%, polyvinylidene fluoride (PVDF) with a mass percentage in a range of 10% to 45%, polyvinyl fluoride (PVF) with a mass percentage in a range of 20% to 35%, and ethylene-chlorotrifluoroethylene copolymer (ECTFE) with a mass percentage in a range of 10% to 30%.

2. The barrier-type photovoltaic solder strip according to claim 1 , wherein a thickness of the moisture barrier layer ranges from 1 μm to 50 μm.

3. The barrier-type photovoltaic solder strip according to claim 2 , wherein the thickness of the moisture barrier layer ranges from 10 μm to 20 μm.

4. The barrier-type photovoltaic solder strip according to claim 1 , wherein the photovoltaic solder strip body has a triangular section, and the moisture barrier layer is wrapped around two surfaces of the photovoltaic solder strip body.

5. The barrier-type photovoltaic solder strip according to claim 1 , wherein the photovoltaic solder strip body has a circular section, and the moisture barrier layer is wrapped around at least three quarters of the photovoltaic solder strip body.

6. The barrier-type photovoltaic solder strip according to claim 1 , wherein the photovoltaic solder strip body has a rectangular section, and the moisture barrier layer is wrapped around two minor surfaces and one major surface of the photovoltaic solder strip body.

7. A photovoltaic module, comprising:
solar cells; and
solder strips connecting between the solar cells, wherein at least one of the solder strips is a barrier-type photovoltaic solder strip capable of reducing damp-heat (DH) attenuation, and comprises a photovoltaic solder strip body, wherein a moisture barrier layer provided on a surface of the photovoltaic solder strip body that is not in contact with an electrode of the solar cells,
wherein a material of the moisture barrier layer comprises tetrafluoroethylene-hexafluoropropylene-vinylidene fluoride copolymer (THV) with a mass percentage in a range of 20% to 55%, polyvinylidene fluoride (PVDF) with a mass percentage in a range of 10% to 45%, polyvinyl fluoride (PVF) with a mass percentage in a range of 20% to 35%, and ethylene-chlorotrifluoroethylene copolymer (ECTFE) with a mass percentage in a range of 10% to 30%.

Assignees

• Zhejiang Jinko Solar Co Ltd
• Jinko Solar Co Ltd

Inventors

• Yu Kun
• Liu Changming
• Zhang Xinyu
• Gao Beibei
• Ma Zengzhi

Classifications

• H10F19/804

  Materials of encapsulations · CPC title

• B23K35/3613

  Polymers, e.g. resins · CPC title

• B23K35/365

  Selection of non-metallic compositions of coating materials either alone or conjoint with selection of soldering or welding materials · CPC title

• B23K35/302

  Cu as the principal constituent · CPC title

• B23K35/268

  Pb as the principal constituent · CPC title