Preparation and application of pb-free nanosolder
US-2017368643-A1 · Dec 28, 2017 · US
Bi as the principal constituent
Bi as the principal constituent · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/264 |
| Official title | {Bi as the principal constituent} |
| Display label | Bi as the principal constituent |
| Total patents | 204 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 22 |
| 2016 | 20 |
| 2017 | 30 |
| 2018 | 22 |
| 2019 | 20 |
| 2020 | 13 |
| 2021 | 19 |
| 2022 | 12 |
| 2023 | 18 |
| 2024 | 16 |
| 2025 | 8 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Solder paste
US-2017348806-A1 · Dec 7, 2017 · US
Conductive particle, and connection material, connection structure, and connecting method of circuit member
US-2017347463-A1 · Nov 30, 2017 · US
Connection structure and connecting method of circuit member
US-2017345782-A1 · Nov 30, 2017 · US
Connecting method of circuit member
US-2017326663-A1 · Nov 16, 2017 · US
Electronic apparatus and method for fabricating the same
US-9812418-B2 · Nov 7, 2017 · US
Hybrid lead-free solder wire
US-9802274-B2 · Oct 31, 2017 · US
High Impact Solder Toughness Alloy
US-2017304955-A1 · Oct 26, 2017 · US
Solder preforms and solder alloy assembly methods
US-9801285-B2 · Oct 24, 2017 · US
Electronic apparatus and method for fabricating the same
US-9761552-B2 · Sep 12, 2017 · US
Ultrasonic probe and method of manufacturing the same
US-2017202539-A1 · Jul 20, 2017 · US
Flux and Solder Paste
US-2017190005-A1 · Jul 6, 2017 · US
Solder material and connected structure
US-9656351-B2 · May 23, 2017 · US
Semiconductor device having connection terminal of solder
US-9620470-B2 · Apr 11, 2017 · US
Printed circuit board with flux reservoir
US-2017094782-A1 · Mar 30, 2017 · US
Stable undercooled metallic particles for engineering at ambient conditions
US-2017014958-A1 · Jan 19, 2017 · US
Electronic apparatus and method for fabricating the same
US-2017012013-A1 · Jan 12, 2017 · US
Lead-free solder compositions
US-2017008131-A1 · Jan 12, 2017 · US
Electronic apparatus and method for fabricating the same
US-9530745-B2 · Dec 27, 2016 · US
Solder material and connected structure
US-2016354868-A1 · Dec 8, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/264?
- CPC B23K35/264 is the Cooperative Patent Classification code for “Bi as the principal constituent.”
- How many patents are filed under CPC B23K35/264 (Bi as the principal constituent)?
- Our database includes 204 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/264 growing?
- Publication counts under this code: 16 in 2024 vs 8 in 2025 (latest complete years).