Flux and Solder Paste

Patent metadata

Field	Value
Publication number	US-2017190005-A1
Application number	US-201515128231-A
Country	US
Kind code	A1
Filing date	Feb 27, 2015
Priority date	Mar 25, 2014
Publication date	Jul 6, 2017
Grant date	—

Abstract

Provided is a flux which can remove metal oxides to improve solder wettability and can fix the object to be soldered with flux residue. The flux contains thermosetting resin, and long-chain dibasic acid mixture including one or more species of first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator, and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals. It is preferable that content of the thermosetting resin is 30% through 70% and content of the long-chain dibasic acid mixture is 20% through 60%.

First claim

1 . A flux comprising:
thermosetting resin; and long-chain dibasic acid mixture including one or more species of: first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator; and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals.

2 . The flux according to claim 1 wherein the long-chain dibasic acid mixture contains, as the second long-chain dibasic acid, one or more species of long-chain dibasic acid having two or more alkoxycarbonyl groups.

3 . The flux according to claim 1 characterized in that the flux comprises the long-chain dibasic acid mixture including the alkoxycarbonyl group which is a methoxycarbonyl group.

4 . The flux according to claim 3 characterized in that the long-chain dibasic acid mixture is mixture of any of compounds having following compositions (1), (2), (3) or (4) or a combination of two or more compounds thereof at predetermined proportion,
(1) 2-methyl nonanedioic acid,
(2) 4-(methoxycarbonyl)-2,4-dimethyl undecanedioic acid,
(3) 4,6-bis(methoxycarbonyl)-2,4,6-trimethyl tridecanedioic acid, and
(4) 8, 9-bis(methoxycarbonyl)-8,9-dimethyl hexadecanodioic acid.

5 . The flux according to claim 4 characterized in that the proportion of the long-chain dibasic acid mixture shown in the compositions (1) through (4) is as follows:
(1) 30% through 60%;
(2) 8% through 20%;
(3) 8% through 20%; and
(4) 15% through 30%.

6 . The flux according to claim 1 characterized in that content of the thermosetting resin is 30% through 40% and content of the long-chain dibasic acid mixture is 20% through 60%.

7 . The flux according to claim 1 characterized in that a solvent of 0.1% through 40% is added into the flux.

8 . A solder paste characterized in that in the solder paste, a flux and solder alloy powder are mixed, the flux containing:
thermosetting resin; and long-chain dibasic acid mixture including one or more species of: first long-chain dibasic acid having an alkyl group in a side chain, the first long-chain dibasic acid being added as a hardening agent for hardening the thermosetting resin and an activator; and second long-chain dibasic acid having an alkyl group and an alkoxycarbonyl group in a side chain and having carbon number of 8 or more in a main chain between the carboxyl groups at opposite terminals.

9 . The solder paste according to claim 8 characterized in that content of the thermosetting resin in the flux is 30% through 40% and content of the long-chain dibasic acid mixture in the flux is 20% through 60%.

10 . The flux according to claim 2 characterized in that the flux comprises the long-chain dibasic acid mixture including the alkoxycarbonyl group which is a methoxycarbonyl group.

11 . The flux according to claim 2 characterized in that content of the thermosetting resin is 30% through 40% and content of the long-chain dibasic acid mixture is 20% through 60%.

12 . The flux according to claim 3 characterized in that content of the thermosetting resin is 30% through 40% and content of the long-chain dibasic acid mixture is 20% through 60%.

13 . The flux according to claim 4 characterized in that content of the thermosetting resin is 30% through 40% and content of the long-chain dibasic acid mixture is 20% through 60%.

14 . The flux according to claim 5 characterized in that content of the thermosetting resin is 30% through 40% and content of the long-chain dibasic acid mixture is 20% through 60%.

15 . The flux according to claim 2 characterized in that a solvent of 0.1% through 40% is added into the flux.

16 . The flux according to claim 3 characterized in that a solvent of 0.1% through 40% is added into the flux.

17 . The flux according to claim 4 characterized in that a solvent of 0.1% through 40% is added into the flux.

18 . The flux according to claim 5 characterized in that a solvent of 0.1% through 40% is added into the flux.

19 . The flux according to claim 6 characterized in that a solvent of 0.1% through 40% is added into the flux.

Assignees

• Senju Metal Industry Co
• Senju Metal Industry Co

Inventors

• Uehata Masashi
• Yamagawa Yasuyuki
• Kitazawa Kazuya
• Takagi Yoshinori

Classifications

• C22C13/00

  Alloys based on tin · CPC title

• B23K35/3613

  Polymers, e.g. resins · CPC title

• B23K35/025

  Pastes, creams or slurries · CPC title

• B23K35/264

  Bi as the principal constituent · CPC title

• B23K35/36 Primary

  Selection of non-metallic compositions, e.g. coatings or fluxes (B23K35/34 takes precedence); Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest · CPC title