Bi-BASED SOLDER ALLOY, METHOD OF BONDING ELECTRONIC COMPONENT USING THE SAME, AND ELECTRONIC COMPONENT-MOUNTED BOARD
US-2016234945-A1 · Aug 11, 2016 · US
Solder preforms and solder alloy assembly methods
US9801285B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9801285-B2 |
| Application number | US-201314386601-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 15, 2013 |
| Priority date | Mar 20, 2012 |
| Publication date | Oct 24, 2017 |
| Grant date | Oct 24, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.
First claim
Opening claim text (preview).
What is claimed is: 1. A method of assembly, comprising: applying SAC solder paste to an electronic substrate to form a solder paste deposit; placing a low temperature preform in the SAC solder paste deposit, wherein the low temperature preform has a melting temperature below the melting temperature of the SAC solder paste; processing the electronic substrate at a reflow temperature of the SAC solder paste to create a low temperature solder joint; and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the SAC solder paste; wherein the reflow temperature of the low temperature solder joint is between 138-170° C. 2. The method of claim 1 , wherein the low temperature preform is a composition consisting of tin and bismuth. 3. The method of claim 2 , wherein the composition consists of 42% by weight tin and 58% by weight bismuth. 4. The method of claim 2 , wherein the composition further consists of silver. 5. The method of claim 1 , wherein the solder joint consists of tin, silver, copper, and bismuth. 6. The method of claim 5 , wherein the solder joint consists of 49-53% by weight tin, 0-1.0% by weight silver, 0-0.1% by weight copper, and 46-50% by weight bismuth. 7. The method of claim 1 , further comprising a second solder process at a temperature between the lower reflow temperature and the reflow temperature. 8. The method of claim 1 , wherein the composition consists of 55% by weight tin and 45% by weight bismuth.
Assignees
Inventors
Classifications
Printed circuits · CPC title
- H05K3/34Primary
by soldering · CPC title
Bi as the principal constituent · CPC title
Pastes, creams or slurries · CPC title
Sn as the principal constituent · CPC title
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Frequently asked questions
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- What does patent US9801285B2 cover?
- A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and p…
- Who is the assignee on this patent?
- Alpha Assembly Solutions Inc
- What technology area does this patent fall under?
- Primary CPC classification H05K3/34. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 24 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).