Braze joints
US-2016375516-A1 · Dec 29, 2016 · US
Selection of soldering or welding materials proper (B23K35/34 takes precedence)
Selection of soldering or welding materials proper (B23K35/34 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/24 |
| Official title | Selection of soldering or welding materials proper (B23K35/34 takes precedence) |
| Display label | Selection of soldering or welding materials proper (B23K35/34 takes precedence) |
| Total patents | 242 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 30 |
| 2016 | 38 |
| 2017 | 37 |
| 2018 | 26 |
| 2019 | 17 |
| 2020 | 20 |
| 2021 | 20 |
| 2022 | 18 |
| 2023 | 17 |
| 2024 | 10 |
| 2025 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Composition and methods of forming solder bump and flip chip using the same
US-9462736-B2 · Oct 4, 2016 · US
Welded joint of extremely low-temperature steel, and welding materials for preparing same
US-2016271736-A1 · Sep 22, 2016 · US
Low-stress TSV design using conductive particles
US-9433100-B2 · Aug 30, 2016 · US
Method for producing a metal-ceramic soldered connection
US-2016228966-A1 · Aug 11, 2016 · US
Soldering method using a low-temperature solder paste
US-9402321-B2 · Jul 26, 2016 · US
Heat treating and brazing of an object
US-9399271-B2 · Jul 26, 2016 · US
Multilayer braze tape
US-2016207129-A1 · Jul 21, 2016 · US
Mounted structure and manufacturing method of mounted structure
US-9386699-B2 · Jul 5, 2016 · US
A novel brazing concept
US-2016175990-A1 · Jun 23, 2016 · US
Mounting structure and manufacturing method for same
US-9373595-B2 · Jun 21, 2016 · US
Methods for joining ceramic and metallic structures
US-2016172713-A1 · Jun 16, 2016 · US
Semiconductor device and method of manufacturing the semiconductor device
US-2016172322-A1 · Jun 16, 2016 · US
Joining sheet, electronic component, and producing method thereof
US-9357645-B2 · May 31, 2016 · US
Methods and compositions for brazing, and earth-boring tools formed from such methods and compositions
US-2016136761-A1 · May 19, 2016 · US
Methods and compositions for brazing
US-2016136762-A1 · May 19, 2016 · US
Hybrid braze tapes and hybrid braze tape methods
US-2016129533-A1 · May 12, 2016 · US
Lead-free solder composition for glass
US-9333594-B2 · May 10, 2016 · US
Laser subassembly metallization for heat assisted magnetic recording
US-2016118075-A1 · Apr 28, 2016 · US
Alloy powder for overlay welding, and weld overlay alloy member and engine valve obtained using the same
US-2016102387-A1 · Apr 14, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/24?
- CPC B23K35/24 is the Cooperative Patent Classification code for “Selection of soldering or welding materials proper (B23K35/34 takes precedence).”
- How many patents are filed under CPC B23K35/24 (Selection of soldering or welding materials proper (B23K35/34 takes precedence))?
- Our database includes 242 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/24 growing?
- Publication counts under this code: 10 in 2024 vs 9 in 2025 (latest complete years).