Photocurable compositions
US-9217920-B2 · Dec 22, 2015 · US
Joining sheet, electronic component, and producing method thereof
US9357645B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9357645-B2 |
| Application number | US-201313804376-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 14, 2013 |
| Priority date | Mar 27, 2012 |
| Publication date | May 31, 2016 |
| Grant date | May 31, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
First claim
Opening claim text (preview).
What is claimed is: 1. A joining sheet comprising: a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles, but does not substantially contain a thermosetting resin; and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin. 2. The joining sheet according to claim 1 , wherein the thermosetting resin-containing layer further contains a thermoplastic resin and the content ratio of the thermosetting resin with respect to the thermosetting resin-containing layer is above 10 volume % and below 47.5 volume %. 3. The joining sheet according to claim 1 , wherein the content ratio of the solder particles with respect to the solder layer is above 40 volume % and below 90 volume %. 4. The joining sheet according to claim 1 , wherein the active agent is a carboxylic acid. 5. The joining sheet according to claim 1 , wherein the thermosetting resin contains an epoxy resin. 6. The joining sheet according to claim 1 , wherein the solder particles are made of a tin-bismuth alloy. 7. The joining sheet according to claim 1 , wherein the thermosetting resin-containing layer further contains a curing agent and a curing accelerator. 8. The joining sheet according to claim 1 , wherein the thermosetting resin-containing layer is also laminated on the other surface in the thickness direction of the solder layer. 9. A method for producing an electronic component comprising the steps of: preparing a laminate in which a joining sheet is disposed between two pieces of wired circuit boards arranged so that corresponding terminals thereof are spaced in opposed relation to each other, wherein the joining sheet comprises a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles, but does not substantially contain a thermosetting resin, and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin; and heating the laminate at a temperature that is not less than the melting point of the solder particles. 10. An electronic component obtained by a method for producing an electronic component, wherein the method for producing an electronic component comprises the steps of: preparing a laminate in which a joining sheet is disposed between two pieces of wired circuit boards arranged so that corresponding terminals thereof are spaced in opposed relation to each other, and the joining sheet comprises a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles, but does not substantially contain a thermosetting resin, and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin; and heating the laminate at a temperature that is not less than the melting point of the solder particles.
Assignees
Inventors
Classifications
Of metal · CPC title
parallel to each other (H05K3/361 takes precedence) · CPC title
- B23K35/24Primary
Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title
- H05K1/092Primary
Dispersed materials, e.g. conductive pastes or inks · CPC title
Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9357645B2 cover?
- A joining sheet includes a solder layer which contains solder particles, a thermoplastic resin, and an active agent capable of activating the solder particles and a thermosetting resin-containing layer which is laminated on at least one surface in a thickness direction of the solder layer and contains a thermosetting resin.
- Who is the assignee on this patent?
- Nitto Denko Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K35/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue May 31 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).