Composition and methods of forming solder bump and flip chip using the same

Patent metadata

Field	Value
Publication number	US-9462736-B2
Application number	US-201414325482-A
Country	US
Kind code	B2
Filing date	Jul 8, 2014
Priority date	Jul 10, 2008
Publication date	Oct 4, 2016
Grant date	Oct 4, 2016

Abstract

Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

First claim

What is claimed is:

1. A method of forming a flip chip, comprising:
providing a first substrate on which first conductive patterns are formed and a second substrate on which second conductive patterns are formed;
arranging the first substrate and the second substrate such that the first conductive patterns and the second conductive patterns face each other;
providing a first composition between the first and second substrates such that the first composition comes in contact with an entire upper surface of the second substrate and fills a space between the first and second substrates, the first composition comprising a low melting point solder, a thermal-curable polymer resin, and a curing agent of an anhydride family material; and
forming a contact portion connecting the first and second conductive patterns, the contact portion being made of the low melting point solder.

2. The method of claim 1 , wherein the thermal-curable polymer resin comprises a hydroxyl group, a material having a carboxyl group is generated through a reaction between the thermal-curable polymer resin having the hydroxyl group and the curing agent of the anhydride family material, and the material is used as a reductant removing an oxide on the low melting point solder or on the first and second conductive patterns.

3. The method of claim 1 , wherein the low melting point solder is used as a curing catalyst.

4. The method of claim 1 , further comprising providing a carbon nano tube-copper (CNT-Cu).

5. The method of claim 1 , wherein during the providing of the first composition, the space between the first and second substrates is filled with the thermal-curable polymer resin and the low melting point solder is dispersed in the thermal-curable polymer resin.

6. The method of claim 1 , wherein the first composition comes in contact with an entire lower surface of the first substrate.

7. The method of claim 1 , wherein the forming of the contact portion comprises:
melting the low melting point solder; and
curing the thermal-curable polymer resin.

8. The method of claim 7 , wherein, when the low melting point solder is melted, the low melting point solder agglomerates on both a surface of the first conductive patterns and a surface of the second conductive patterns.

Assignees

• Electronics & Telecommunications Res Inst

Inventors

• Eom Yong Sung
• Moon Jong Tae
• Oh Sangwon
• Jang Keonsoo

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W72/07331

  Connecting techniques · CPC title

• H10W72/01351

  Changing the shapes of die-attach connectors · CPC title

• H10W72/01333

  in liquid form, e.g. spin coating, spray coating or immersion coating · CPC title