Laser subassembly metallization for heat assisted magnetic recording

Patent metadata

Field	Value
Publication number	US-2016118075-A1
Application number	US-201614987083-A
Country	US
Kind code	A1
Filing date	Jan 4, 2016
Priority date	Apr 24, 2012
Publication date	Apr 28, 2016
Grant date	—

Abstract

A heat assisted magnetic recording (HAMR) assembly includes a slider, a laser diode and solder connections between the laser diode and the slider. The solder connections mechanically and electrically attach the laser diode to the slider. Each solder connection has a total volume per unit area (i.e., height) of less than or equal to about 15 μm. The solder connections have a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones. The eutectic zone occupies greater than or equal to about 35% of the total volume per unit area of the solder connection.

First claim

1 - 21 . (canceled)

22 . A heat assisted magnetic recording (HAMR) assembly, comprising;
a slider comprising read and write transducers; a laser diode; solder connections between the laser diode and the slider that mechanically and electrically attach the laser diode to the slider, each solder connection having a surface area at the laser diode of less than 300 μm 2 , a surface area at the slider of less than 300 μm 2 , a total volume per unit area of less than or equal to 8 μm, and having a first intermetallic zone adjacent to the laser diode, a second intermetallic zone adjacent to the slider, and a eutectic zone of eutectic material between the first and second intermetallic zones, the eutectic zone occupying greater than or equal to about 35% of the total volume per unit area of the solder connection.

23 . The assembly of claim 22 , wherein the eutectic material is an Sn-containing eutectic material.

24 . The assembly of claim 23 , wherein the eutectic material is Sn—Ag or Au—Sn.

25 . The assembly of claim 22 , wherein the eutectic material is about 96.5 wt. % Sn and about 3.5 wt. % Ag.

26 . The assembly of claim 22 , wherein the eutectic material is about 90 wt. % Au and about 10% Sn.

27 . The assembly of claim 22 , wherein the volume per unit area is less than or equal to about 4 μm.

28 . An assembly, comprising:
a substrate; an electronic component; solder connections between the electronic component and the substrate that mechanically and electrically attaches the electrical component to the substrate, at least one of the solder connections having a surface area at the electronic component of less than 300 μm 2 , and a surface area at the substrate of less than 300 μm 2 , a total volume per unit area of less than or equal to about 8 μm and having a first intermetallic zone adjacent to the electronic component, a second intermetallic zone adjacent to the substrate, and a eutectic zone of eutectic material between the first and second intermetallic zones, the eutectic zone occupying greater than or equal to about 35% of the total volume per unit area of the solder connection.

29 . The assembly of claim 28 , wherein the eutectic material is an Sn-containing eutectic material.

30 . The assembly of claim 28 , wherein the volume per unit area is less than or equal to about 4 μm.

Assignees

• Seagate Technology Llc

Inventors

• Hurley Jon Paul
• Bell Bernard W
• Axdal Steven Harlow Anderson

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• G11B13/04

  magnetically {or by magnetisation} and optically {or by radiation, for changing or sensing optical properties} · CPC title

• G11B5/6005

  Specially adapted for spacing from a rotating disc using a fluid cushion · CPC title