Photocurable compositions
US-9217920-B2 · Dec 22, 2015 · US
Lead-free solder composition for glass
US9333594B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9333594-B2 |
| Application number | US-201213712326-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 12, 2012 |
| Priority date | Aug 13, 2012 |
| Publication date | May 10, 2016 |
| Grant date | May 10, 2016 |
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- Title
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- Abstract
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- First independent claim
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Abstract
Official abstract text for this publication.
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
First claim
Opening claim text (preview).
What is claimed is: 1. A composition, consisting of: indium (In) in an amount from about 30.0 wt % to about 60.0 wt %; zinc (Zn) in an amount from about 0.01 wt % to 11.0 wt %; at least two elements selected from the group consisting of: copper (Cu) in an amount from about 0.1 wt % to about 3.0 wt %, manganese (Mn) in an amount from about 0.01 wt % to about 0.5 wt % and nickel (Ni) in an amount from about 0.01 wt % to about 0.5 wt %; and tin (Sn) as the remaining component. 2. The composition of claim 1 , wherein the composition is prepared for use in manufacturing a solder pre-form selected from the group consisting of a solder paste, a solder ball, a solder bar, a solder wire, a solder bump, a solder plate, a solder powder, a solder pellet, a solder particle, a solder ribbon, a solder washer, and a solder ring. 3. The composition of claim 1 , wherein the amount of In is 30.0 wt %. 4. The composition of claim 1 , wherein the amount of In is 60 wt %. 5. The composition of claim 1 , wherein the amount of Zn is 11.0 wt %. 6. A composition, consisting of: 30.0 wt % indium (In); 0.01 wt % zinc (Zn); at least two elements selected from the group consisting of: copper (Cu), wherein the amount of Cu ranges from about 0.1 wt % to about 3.0 wt %, manganese (Mn) wherein the amount of Mn ranges from about 0.01 wt % to about 0.5 wt %, and nickel (Ni), wherein the amount of Ni ranges from about 0.01 wt % to about 0.5 wt %; and remainder tin (Sn). 7. The composition of claim 6 , wherein the composition is prepared for use in manufacturing a solder pre-form selected from the group consisting of a solder paste, a solder ball, a solder bar, a solder wire, a solder bump, a solder plate, a solder powder, a solder pellet, a solder particle, a solder ribbon, a solder washer, and a solder ring.
Assignees
Inventors
Classifications
Powders, particles or spheres; Preforms made therefrom · CPC title
Sn as the principal constituent · CPC title
- B23K35/24Primary
Selection of soldering or welding materials proper (B23K35/34 takes precedence) · CPC title
Rods, electrodes or wires · CPC title
Pastes, creams or slurries · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9333594B2 cover?
- The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
- Who is the assignee on this patent?
- Hyundai Motor Co Ltd, Kia Motors Corp, Korea Autoglass Corp, and 1 more
- What technology area does this patent fall under?
- Primary CPC classification B23K35/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue May 10 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).