Bonded substrate
US-2021387923-A1 · Dec 16, 2021 · US
at least one of the workpieces being of copper or another noble metal
at least one of the workpieces being of copper or another noble metal · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K35/007 |
| Official title | {at least one of the workpieces being of copper or another noble metal} |
| Display label | at least one of the workpieces being of copper or another noble metal |
| Total patents | 85 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 20 |
| 2016 | 6 |
| 2017 | 15 |
| 2018 | 5 |
| 2019 | 7 |
| 2020 | 5 |
| 2021 | 4 |
| 2022 | 4 |
| 2023 | 7 |
| 2024 | 9 |
| 2025 | 1 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Bonded body and insulating circuit substrate
US-10998250-B2 · May 4, 2021 · US
Method for the electrical bonding of semiconductor components
US-2020402950-A1 · Dec 24, 2020 · US
Bonded body and insulating circuit substrate
US-2020321264-A1 · Oct 8, 2020 · US
Bonding material, and bonding method and bonded structure each using same
US-10751841-B2 · Aug 25, 2020 · US
Method of welding a nickel strength lug with a bronze connecting pin and a brass contact ring in an accelerometer sensor
US-10744588-B2 · Aug 18, 2020 · US
Multi-metallic articles of manufacture
US-2020230697-A1 · Jul 23, 2020 · US
Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint
US-2019358751-A1 · Nov 28, 2019 · US
Ceramic circuit substrate and method for producing ceramic circuit substrate
US-10485112-B2 · Nov 19, 2019 · US
Brazing concept
US-10421141-B2 · Sep 24, 2019 · US
Coating concept
US-10335881-B2 · Jul 2, 2019 · US
Ceramic circuit substrate and method for producing ceramic circuit substrate
US-2019150298-A1 · May 16, 2019 · US
Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate
US-10256113-B2 · Apr 9, 2019 · US
Solder alloy
US-10213879-B2 · Feb 26, 2019 · US
Repair method and repair material
US-2018369951-A1 · Dec 27, 2018 · US
Method and device for producing a component of a turbomachine
US-10144062-B2 · Dec 4, 2018 · US
Method for joining metal parts
US-10131011-B2 · Nov 20, 2018 · US
Braze alloy layered product
US-10112249-B2 · Oct 30, 2018 · US
Bonding material, and bonding method and bonded structure each using same
US-2018297152-A1 · Oct 18, 2018 · US
Brazing concept
US-9849534-B2 · Dec 26, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K35/007?
- CPC B23K35/007 is the Cooperative Patent Classification code for “at least one of the workpieces being of copper or another noble metal.”
- How many patents are filed under CPC B23K35/007 (at least one of the workpieces being of copper or another noble metal)?
- Our database includes 85 publications tagged with this CPC code.
- Is patent activity under CPC B23K35/007 growing?
- Publication counts under this code: 9 in 2024 vs 1 in 2025 (latest complete years).