Flux and solder paste
US-2024278360-A1 · Aug 22, 2024 · US
Solder alloy for bonding cu pipes and/or fe pipes, preform solder, resin flux cored solder, and solder joint
US2019358751A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2019358751-A1 |
| Application number | US-201816341386-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jun 7, 2018 |
| Priority date | Sep 20, 2017 |
| Publication date | Nov 28, 2019 |
| Grant date | — |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A solder alloy for joining a Cu pipe and/or a Fe pipe has an alloy composition comprising in mass %: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; and Co: 0.025% to 0.3%, with a balance being Sn. The alloy composition satisfies the relationship of 0.07≤Co/Ni≤6, where Co and Ni represent contents of Co and Ni in mass %, respectively.
First claim
Opening claim text (preview).
1 . A solder alloy for joining a Cu pipe and/or a Fe pipe, the solder alloy having an alloy composition comprising in mass %: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; and Co: 0.025% to 0.3%, with a balance being Sn, wherein the alloy composition satisfies the following relationship (1): 0.07≤Co/Ni≤6 (1) wherein Co and Ni represent contents of Co and Ni in mass %, respectively. 2 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 , wherein the alloy composition further comprises, in mass %, Sb: 5.0% to 9.0%. 3 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 , wherein the alloy composition further comprises, in mass %, Cu: 0.5% to 3.0%. 4 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 , wherein the alloy composition further comprises, in mass %, Ni: 0.025% to 0.1%. 5 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 , which has a liquidus temperature of 450° C. or lower. 6 . A preform solder comprising the solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 . 7 . A flux-cored solder comprising the solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 . 8 . A solder joint comprising the solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 1 . 9 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 2 , wherein the alloy composition further comprises, in mass %, Cu: 0.5% to 3.0%. 10 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 2 , wherein the alloy composition further comprises, in mass %, Ni: 0.025% to 0.1%. 11 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 3 , wherein the alloy composition further comprises, in mass %, Ni: 0.025% to 0.1%. 12 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 9 , wherein the alloy composition further comprises, in mass %, Ni: 0.025% to 0.1%. 13 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 2 , which has a liquidus temperature of 450° C. or lower. 14 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 3 , which has a liquidus temperature of 450° C. or lower. 15 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 4 , which has a liquidus temperature of 450° C. or lower. 16 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 9 , which has a liquidus temperature of 450° C. or lower. 17 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 10 , which has a liquidus temperature of 450° C. or lower. 18 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 11 , which has a liquidus temperature of 450° C. or lower. 19 . The solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 12 , which has a liquidus temperature of 450° C. or lower. 20 . A preform solder comprising the solder alloy for joining a Cu pipe and/or a Fe pipe according to claim 2 .
Assignees
Inventors
Classifications
with antimony or bismuth as the next major constituent · CPC title
Powders, particles or spheres; Preforms made therefrom · CPC title
Copper or alloys thereof · CPC title
Iron or ferrous alloys · CPC title
Ferrous alloys and copper or alloys thereof · CPC title
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Frequently asked questions
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- What does patent US2019358751A1 cover?
- A solder alloy for joining a Cu pipe and/or a Fe pipe has an alloy composition comprising in mass %: Sb: 5.0% to 15.0%; Cu: 0.5% to 8.0%; Ni: 0.025% to 0.7%; and Co: 0.025% to 0.3%, with a balance being Sn. The alloy composition satisfies the relationship of 0.07≤Co/Ni≤6, where Co and Ni represent contents of Co and Ni in mass %, respectively.
- Who is the assignee on this patent?
- Senju Metal Industry Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Thu Nov 28 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).