Joining method, joint structure, electronic device, method for manufacturing electronic device and electronic part
US-9614295-B2 · Apr 4, 2017 · US
Bonding material, and bonding method and bonded structure each using same
US10751841B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10751841-B2 |
| Application number | US-201816015279-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 22, 2018 |
| Priority date | Feb 1, 2016 |
| Publication date | Aug 25, 2020 |
| Grant date | Aug 25, 2020 |
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- Title
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Abstract
Official abstract text for this publication.
A bonding material having a first layer containing Sn as a main component thereof and a second layer containing a metal having a higher melting point than that of Sn as a main component thereof, wherein the first layer and the second layer are laminated on each other, and an amount of Sn in the first layer is larger than a stoichiometric amount of Sn that forms an intermetallic compound between the Sn and the metal.
First claim
Opening claim text (preview).
The invention claimed is: 1. A bonding material for bonding two objects to each other, the bonding material comprising: a first layer containing a first metal, and the first metal is a material that contains Sn as a most abundant element by weight %; and a second layer containing a second metal, the second metal has a material having a higher melting point than that of Sn as a most abundant material by weight % of the second metal, wherein the first layer and the second layer are laminated on each other, and an amount of Sn in the first layer is larger than a stoichiometric amount of Sn that forms an intermetallic compound between the Sn in the first layer and the second metal in the second layer. 2. The bonding material according to claim 1 , wherein the second metal in the second layer is a CuNi alloy. 3. The bonding material according to claim 2 , wherein the intermetallic compound is (CuNi) 6 Sn 5 , and the amount of the CuNi alloy is 40 wt % and the amount of the Sn is 65 wt % or more, respectively, relative to a sum total of the stoichiometric amount of Sn and a stoichiometric amount of the CuNi alloy needed to form the intermetallic compound. 4. The bonding material according to claim 1 , wherein the second metal in the second layer is in a powder form. 5. The bonding material according to claim 1 , wherein the second layer is arranged between two of the first layers. 6. The bonding material according to claim 1 , wherein the second layer contains a flux. 7. The bonding material according to claim 1 , wherein the bonding material is in the form of a sheet or tape.
Assignees
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Classifications
taking account of the properties of the materials to be soldered · CPC title
with nickel or cobalt as the next major constituent · CPC title
Cu as the principal constituent · CPC title
Powders, particles or spheres; Preforms made therefrom · CPC title
Alloys based on tin · CPC title
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- What does patent US10751841B2 cover?
- A bonding material having a first layer containing Sn as a main component thereof and a second layer containing a metal having a higher melting point than that of Sn as a main component thereof, wherein the first layer and the second layer are laminated on each other, and an amount of Sn in the first layer is larger than a stoichiometric amount of Sn that forms an intermetallic compound between…
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification B23K35/262. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 25 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).