Low-temperature nanosolders
US-9463532-B2 · Oct 11, 2016 · US
US10112249B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10112249-B2 |
| Application number | US-201314388552-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 27, 2013 |
| Priority date | Mar 28, 2012 |
| Publication date | Oct 30, 2018 |
| Grant date | Oct 30, 2018 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
The present invention relates to a method for providing a braze alloy layered product comprising the following steps: —applying at least one silicon source and at least one boron source on at least a part of a surface of a substrate, wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; —heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining the braze alloy layered product. The present invention relates further to a braze alloy layered product, a method for providing a brazed product, a method for providing a coated product, and uses of the braze alloy layered product.
Opening claim text (preview).
The invention claimed is: 1. A method for providing a braze alloy layered product comprising the following steps: applying a mechanical blend on at least a part of a surface of a substrate, wherein the mechanical blend is a mechanical blend of at least one powder of particles of a silicon source, in which each particle is of a silicon source, and at least one powder of particles of a boron source, in which each particle is of a boron source, wherein the particles have an average particle size less than 250 μm wherein the at least one boron source and the at least one silicon source are oxygen free except for inevitable amounts of contaminating oxygen, wherein the amount of inevitable amount of oxygen is less than 10 wt %, and wherein the weight ratio in the blend of boron and silicon is within a range from about 3:100 to about 100:3, and wherein silicon and boron are present together in the blend in at least 35 wt %, and wherein the substrate comprises a parent material having a solidus temperature above 1100° C.; heating the substrate having the applied boron source and the applied silicon source to a temperature lower than the solidus temperature of the parent material of the substrate to form a braze alloy; and cooling the substrate having the applied boron source and the applied silicon source, and obtaining a layer of braze alloy on the substrate, wherein the layer of braze alloy comprises the silicon source, the boron source and the elements of the parent material, wherein the braze alloy layer has a melting point lower than the parent material; wherein the silicon source is one or more of elemental silicon, an alloy containing silicon, or a compound containing silicon; and wherein the boron source is one or more of elemental boron, an alloy containing boron, or a compound containing boron. 2. The method according to claim 1 , wherein the at least one boron source and the at least one silicon source is the same source. 3. The method according to claim 1 , wherein the boron source is selected from elemental boron, boron carbides, nickel borides, or silicon borides. 4. The method according to claim 1 , wherein the silicon source is selected from elemental silicon, ferro silicon, iron silicides, silicon carbides, or silicon borides. 5. The method according to claim 1 , wherein the method comprises applying a composition comprising the blend and at least one binder, wherein the at least one binder is selected from solvents, water, oils, gels, lacquers, varnish, binders based on monomers, polymers, waxes, or combinations thereof. 6. The method according to claim 1 , wherein the method comprises applying a composition comprising the blend and at least one binder, wherein the at least one binder is selected from polyesters, polyethylenes, polypropylenes, acrylic polymers, met acrylic polymers, polyvinyl alcohols, polyvinyl acetates, polystyrenes or waxes or combinations thereof. 7. The method according to claim 1 , wherein the applying step comprises applying a composition comprising the blend, at least one binder, and particles of a parent material, and wherein the parent material is present in an amount less than 75 wt % calculated on the total weight of silicon, boron and parent material. 8. The method according to claim 1 , wherein the applying step comprises applying a composition comprising the blend, at least one binder, and particles of a braze alloy. 9. The method according to claim 1 , wherein the parent material is selected from iron based alloys, nickel based alloys, chromium based alloys, copper based alloys, or cobalt based alloys. 10. The method according to claim 1 , wherein said parent material comprises from about 15 to about 22 wt % chromium, from about 8 to about 22 wt % nickel, from about 0 to about 3 wt % manganese, from about 0 to about 1.5 wt % silicon, optionally from about 1 to about 8 wt % molybdenum, and balanced with iron. 11. The method according to claim 1 , wherein the substrate is a parent material and the parent material comprises more than 50 wt % Fe, less than 13 wt % Cr, less than 1 wt % Mo, less than 1 wt % Ni and less than 3 wt % Mn. 12. The method according to claim 1 , wherein the substrate is a parent material and wherein the parent material comprises more than 10 wt % Cr and more than 60 wt % Ni. 13. The method according to claim 1 , wherein the substrate is a parent material and wherein the parent material comprises more than 15 wt % Cr, more than 10 wt % Mo, and more than 50 wt % Ni. 14. The method according to claim 1 , wherein the substrate is a parent material and wherein the parent material comprises more than 10 wt % Fe, 0.1 to 30 wt % Mo, 0.1 to 30 wt % Ni, and more than 50 wt % Co. 15. The method according to claim 1 , wherein the substrate is a parent material and wherein the parent material comprises more than 80 wt % Ni. 16. The method according to claim 1 , wherein the method comprises heating the substrate having a surface layer of the applied blend to a temperature higher than the melting point of the braze alloy. 17. The method according to claim 1 , wherein the method comprises heating the substrate having a surface layer of the applied blend to a temperature higher than 900° C. 18. The method according to claim 1 , wherein elements of the surface of the substrate and the blend are alloyed in the heating step to obtain a molten phase. 19. The method according to claim 1 , wherein the method further comprises an additional step before the applying step, said additional step comprises cutting or forming or combinations thereof of the substrate. 20. The method according to claim 1 , wherein the method further comprises an additional step before the applying step or after the applying step or after the heating step, said additional step comprises cutting or forming or combinations thereof of the substrate.
Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title
Polymers, e.g. resins · CPC title
by melting {(C22C1/1036 takes precedence)} · CPC title
in the form of local deformations of the element · CPC title
Interlayers, transition pieces for metallurgical bonding of workpieces · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.