Solder Alloy, Solder Paste, Solder Ball, Solder Preform, Solder Joint, Vehicle-Mounted Electronic Circuit, ECU Electronic Circuit, Vehicle-Mounted Electronic Circuit Device, and ECU Electronic Circuit Device
US-2024238914-A1 · Jul 18, 2024 · US
for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/0623 |
| Official title | {for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets} |
| Display label | for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets |
| Total patents | 298 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 32 |
| 2016 | 31 |
| 2017 | 33 |
| 2018 | 35 |
| 2019 | 27 |
| 2020 | 27 |
| 2021 | 18 |
| 2022 | 21 |
| 2023 | 29 |
| 2024 | 23 |
| 2025 | 17 |
| 2026 | 5 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Head assembly for mounting conductive ball
US-2024009747-A1 · Jan 11, 2024 · US
Solder bump forming method and apparatus
US-9511438-B2 · Dec 6, 2016 · US
Fabricating pillar solder bump
US-9508594-B2 · Nov 29, 2016 · US
Alignment of three dimensional integrated circuit components
US-9508614-B2 · Nov 29, 2016 · US
Vacuum transition for solder bump mold filling
US-9498837-B2 · Nov 22, 2016 · US
Method and apparatus for forming interface between coaxial cable and connector
US-2016332263-A1 · Nov 17, 2016 · US
Repair method and repair material
US-2016288245-A1 · Oct 6, 2016 · US
Composition and methods of forming solder bump and flip chip using the same
US-9462736-B2 · Oct 4, 2016 · US
Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method
US-2016271715-A1 · Sep 22, 2016 · US
Electrical connector and method for assembling the same
US-2016261057-A1 · Sep 8, 2016 · US
Conductive connections, structures with such connections, and methods of manufacture
US-9437566-B2 · Sep 6, 2016 · US
Jetting discrete volumes of high viscosity liquid
US-2016228905-A1 · Aug 11, 2016 · US
Wafer level packages having non-wettable solder collars and methods for the fabrication thereof
US-9401339-B2 · Jul 26, 2016 · US
Integrated circuit bonding with interposer die
US-2016190071-A1 · Jun 30, 2016 · US
Nozzle for connecting or disconnecting solder joints between head bonding pads in a hard disk drive, and laser soldering or reflowing tool with the same
US-2016184915-A1 · Jun 30, 2016 · US
Alignment of three dimensional integrated circuit components
US-2016172324-A1 · Jun 16, 2016 · US
Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball
US-9364914-B2 · Jun 14, 2016 · US
Laser apparatus with capacitor disposed in vicinity of laser diode
US-2016129513-A1 · May 12, 2016 · US
Solder Ball Jet Nozzle Having Improved Reliability
US-2016121416-A1 · May 5, 2016 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/0623?
- CPC B23K3/0623 is the Cooperative Patent Classification code for “for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets.”
- How many patents are filed under CPC B23K3/0623 (for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets)?
- Our database includes 298 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/0623 growing?
- Publication counts under this code: 23 in 2024 vs 17 in 2025 (latest complete years).