Apparatus and method of attaching solder ball and method of fabricating semiconductor package including solder ball

Patent metadata

Field	Value
Publication number	US-9364914-B2
Application number	US-201414471327-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Nov 7, 2013
Publication date	Jun 14, 2016
Grant date	Jun 14, 2016

Abstract

Provided are apparatuses configured to attach a solder ball, methods of attaching a solder ball, and methods of fabricating a semiconductor package including the same. An apparatus configured to attach a solder ball includes a chuck configured to receive a package substrate on which solder balls are provided; a shielding mask configured to shield the package substrate and including holes configured to expose the solder balls; and a heater configured to melt the solder balls exposed through the holes.

First claim

What is claimed is:

1. A method of attaching a solder ball, the method comprising:
providing solder balls on ball lands mounted on a surface of a package substrate;
providing a shielding mask on the package substrate, the shielding mask covering the package substrate and comprising a flat surface facing the surface of the package substrate and lying in a plane and holes formed in the plane, and exposing the solder balls such that the solder balls penetrate the plane; and
melting the solder balls exposed through the holes by a heater configured to bond the solder balls to the ball lands.

2. The method of claim 1 , further comprising:
coating a flux agent on surfaces of the solder balls before performing the melting of the solder balls.

3. The method of claim 1 , wherein the heater is a light generator configured to emit a laser beam, an infrared ray, or a visible ray.

4. The method of claim 3 , wherein the shielding mask is configured to reflect light.

5. The method of claim 4 , wherein the shielding mask comprises at least one of nickel, iron, stainless steel, silver, and titanium.

6. The method of claim 1 , wherein the heater comprises a heating coil.

7. The method of claim 6 , wherein the shielding mask comprises a heat resistant material.

8. A method of fabricating a semiconductor package, the method comprising:
mounting a semiconductor chip on a package substrate comprising a surface on which ball lands are mounted; and
bonding solder balls to the ball lands by:
providing a shielding mask on the package substrate, the shielding mask covering the package substrate and comprising a flat surface facing the surface of the package substrate and lying in a plane and holes formed in the plane, and exposing the solder balls inserted into the holes; and

melting the solder balls exposed through the holes by a heater configured to bond the solder balls to the ball lands.

9. The method of claim 8 , further comprising:
forming a mold layer covering the semiconductor chip and the package substrate.

10. The method of claim 8 , wherein the semiconductor chip is a memory chip.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Seokhyun
• Jang Jaegwon
• Jang Chul-Yong

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W90/722

  between stacked chips · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title