Laser processing apparatus and laser processing method
US-2021299793-A1 · Sep 30, 2021 · US
disposed on the workpiece
disposed on the workpiece · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K26/0661 |
| Official title | {disposed on the workpiece} |
| Display label | disposed on the workpiece |
| Total patents | 100 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is rapidly declining.
| Year | Patents |
|---|---|
| 2015 | 15 |
| 2016 | 10 |
| 2017 | 4 |
| 2018 | 6 |
| 2019 | 9 |
| 2020 | 7 |
| 2021 | 15 |
| 2022 | 14 |
| 2023 | 10 |
| 2024 | 3 |
| 2025 | 5 |
| 2026 | 2 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element
US-2021269913-A1 · Sep 2, 2021 · US
Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber
US-11077525-B2 · Aug 3, 2021 · US
Method of annealing reflective photomask by using laser
US-2021223680-A1 · Jul 22, 2021 · US
Vapor deposition mask, vapor deposition mask preparation body, method for producing vapor deposition mask, and method for producing organic semiconductor element
US-11041237-B2 · Jun 22, 2021 · US
Device and method for recording information in a data carrier
US-2021086546-A1 · Mar 25, 2021 · US
Method And Device For Laser Welding A First Component To A Second Component
US-2021039195-A1 · Feb 11, 2021 · US
Hybrid wafer dicing approach using a uniform rotating beam laser scribing process and plasma etch process
US-10903121-B1 · Jan 26, 2021 · US
Mask sheet and manufacturing method for the same
US-10883165-B2 · Jan 5, 2021 · US
Method of processing inorganic material substrate, device, and method of manufacturing device
US-2020316712-A1 · Oct 8, 2020 · US
Method of processing workpiece
US-2020215649-A1 · Jul 9, 2020 · US
Systems and methods for dicing samples using a bessel beam matrix
US-10707130-B2 · Jul 7, 2020 · US
Mitigation of particle contamination for wafer dicing processes
US-10661383-B2 · May 26, 2020 · US
Second surface laser ablation
US-10610975-B2 · Apr 7, 2020 · US
Mask assembly, method of manufacturing thereof, and apparatus including the same
US-10533245-B2 · Jan 14, 2020 · US
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
US-10535561-B2 · Jan 14, 2020 · US
Method of Processing a Silicon Carbide Containing Crystalline Substrate, Silicon Carbide Chip, and Processing Chamber
US-2019308274-A1 · Oct 10, 2019 · US
Optical mask plate and laser lift-off device
US-10434599-B2 · Oct 8, 2019 · US
Mitigation of particle contamination for wafer dicing processes
US-2019291206-A1 · Sep 26, 2019 · US
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
US-2019279902-A1 · Sep 12, 2019 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K26/0661?
- CPC B23K26/0661 is the Cooperative Patent Classification code for “disposed on the workpiece.”
- How many patents are filed under CPC B23K26/0661 (disposed on the workpiece)?
- Our database includes 100 publications tagged with this CPC code.
- Is patent activity under CPC B23K26/0661 growing?
- Publication counts under this code: 3 in 2024 vs 5 in 2025 (latest complete years).