Second surface laser ablation

Patent metadata

Field	Value
Publication number	US-10610975-B2
Application number	US-201815897419-A
Country	US
Kind code	B2
Filing date	Feb 15, 2018
Priority date	Oct 3, 2014
Publication date	Apr 7, 2020
Grant date	Apr 7, 2020

Abstract

A method of removing material from an opposite side of workpiece includes directing a laser beam at a first side of the workpiece to remove the material from an opposite second side of the workpiece.

First claim

What is claimed is:

1. A method comprising:
providing a workpiece comprising a substrate having a first surface and an opposing second surface;
disposing a coating layer over the first surface of the substrate;
and
removing a portion of the coating layer from the workpiece by directing a laser beam at the workpiece such that the laser beam passes through the substrate from the opposing second surface to the first surface before the laser beam impinges on the coating layer;
wherein an edge of the coating layer adjacent the portion of the workpiece from which the coating layer has been removed has a characteristic length, L, that is a length of the portion of the edge of the coating layer in which a thickness of the coating layer tapers from a nominal coating layer thickness, t, to zero thickness, and L≤100 μm.

2. The method of claim 1 , wherein disposing the mask comprises a photolithography process or a printing process.

3. The method of claim 1 , wherein disposing the mask comprises placing a pre-formed mask over the second surface of the substrate.

4. The method of claim 1 , wherein removing the portion of the coating layer produces portions of the workpiece from which the coating layer has been removed that have a characteristic dimension that is smaller than a laser spot produced by the laser beam.

5. A method comprising:
providing a workpiece comprising a substrate;
disposing a coating layer over a first surface of the substrate;
disposing a mask over a second surface of the substrate; and
removing a portion of the coating layer from the workpiece by directing a laser beam at the workpiece such that the laser beam passes through the substrate from the second surface to the first surface before the laser beam impinges on the coating layer;
wherein the first surface of the substrate and the second surface of the substrate are opposite surfaces of the substrate, and the mask selectively prevents removal of the coating layer from portions of the workpiece; and
wherein an edge of the coating layer adjacent the portion of the workpiece from which the coating layer has been removed has a characteristic length, L, that is a length of the portion of the edge of the coating layer in which a thickness of the coating layer tapers from a nominal coating layer thickness, t, to zero thickness, and L≤100 μm.

6. The method of claim 5 , wherein L≤50 μm.

7. The method of claim 6 , wherein L≤200 nm.

8. The method of claim 1 , wherein an edge of the coating layer adjacent the portion of the workpiece from which the coating layer has been removed has a uniform shape.

9. The method of claim 1 , wherein an edge of the coating layer adjacent the portion of the workpiece from which the coating layer has been removed has a scalloped profile.

10. The method of claim 9 , wherein a depth of the scallops is between 1% and 20% of a diameter of the laser beam.

11. The method of claim 9 , wherein a depth of the scallops is less than 100 μm.

12. The method of claim 1 , wherein the laser beam is produced by a laser with a pulse duration in a range of 0.5 to 500 picoseconds.

13. A method for comprising:
providing a workpiece comprising a substrate having a first surface and an opposing second surface;
disposing an electrically conductive layer over the first surface;
disposing a coating layer over the electrically conductive layer such that the electrically conductive layer is disposed between the substrate and the coating layer;
disposing a mask over the opposing second surface of the substrate;
removing a portion of the coating layer from the workpiece by directing a laser beam at the workpiece such that the laser beam passes through the substrate from the opposing second surface to the first surface and through the electrically conductive layer before the laser beam impinges on the coating layer;
wherein the mask selectively prevents removal of the coating layer from portions of the workpiece; and
wherein the electrically conductive layer is not removed by the laser beam.

14. The method of claim 13 , wherein the electrically conductive layer comprises a transparent conductive oxide.

15. The method of claim 1 , wherein the coating layer comprises a chromium-containing metallic material.

16. The method of claim 1 , wherein an edge of the coating layer adjacent the portion of the workpiece from which the coating layer has been removed forms an average angle with the first substrate surface in a range of 30° to 90°.

17. The method of claim 1 , wherein the portion of the workpiece from which the coating layer is removed exhibits a transmission haze of 0.05% or less.

18. The method of claim 1 , wherein the portion of the workpiece from which the coating layer is removed exhibits a transmission haze of 0.25% or less.

Assignees

• Gentex Corp

Inventors

• Luten Henry A
• Geerlings Kurtis L
• Bareman Donald L

Classifications

• B23K26/57 Primary

  the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming · CPC title

• B23K2103/08

  Non-ferrous metals or alloys · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title

• B23K26/0661

  disposed on the workpiece · CPC title

• B23K26/361

  for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title