Packaged semiconductor die and CTE-engineering die pair
US-10096535-B2 · Oct 9, 2018 · US
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Hu Chuan patents
Hu Chuan holds 11 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 11 |
| Recent patents | 0 |
| First publication | Jan 20, 2015 |
| Latest publication | Oct 9, 2018 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages
US-9741645-B2 · Aug 22, 2017 · US
Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer
US-9685390-B2 · Jun 20, 2017 · US
Semiconductor device with pre-molding chip bonding
US-9659885-B2 · May 23, 2017 · US
Microelectronic package having direct contact heat spreader and method of manufacturing same
US-9508675-B2 · Nov 29, 2016 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Packaged semiconductor die and CTE-engineering die pair
US-10096535-B2 · Oct 9, 2018 · US
Dense interconnect with solder cap (DISC) formation with laser ablation and resulting semiconductor structures and packages
US-9741645-B2 · Aug 22, 2017 · US
Microelectronic package having non-coplanar, encapsulated microelectronic devices and a bumpless build-up layer
US-9685390-B2 · Jun 20, 2017 · US
Semiconductor device with pre-molding chip bonding
US-9659885-B2 · May 23, 2017 · US
Microelectronic package having direct contact heat spreader and method of manufacturing same
US-9508675-B2 · Nov 29, 2016 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 11 |
| Cross-Sectional Technologies | 3 |
| Operations & Transport | 1 |
| Physics | 1 |