Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
US-9420707-B2 · Aug 16, 2016 · US
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Hu Chuan — Cross-Sectional Technologies
Hu Chuan holds 3 patents in Cross-Sectional Technologies, with representative filings summarized below.
| Metric | Value |
|---|---|
| Company | Hu Chuan |
| Technology | Cross-Sectional Technologies |
| Patents in slice | 3 |
| Recent patents in slice | 0 |
| First year | 2015 |
| Last year | 2016 |
Representative patents
Notable publications linking Hu Chuan to Cross-Sectional Technologies.
Single layer low cost wafer level packaging for SFF SiP
US-9281292-B2 · Mar 8, 2016 · US
Single layer low cost wafer level packaging for SFF SiP
US-9281292-B2 · Mar 8, 2016 · US
Off-plane conductive line interconnects in microelectronic devices
US-9072187-B2 · Jun 30, 2015 · US
Recent filings
Latest patents from Hu Chuan in Cross-Sectional Technologies.
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same
US-9420707-B2 · Aug 16, 2016 · US
Single layer low cost wafer level packaging for SFF SiP
US-9281292-B2 · Mar 8, 2016 · US
Single layer low cost wafer level packaging for SFF SiP
US-9281292-B2 · Mar 8, 2016 · US
Off-plane conductive line interconnects in microelectronic devices
US-9072187-B2 · Jun 30, 2015 · US
Related pages
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