Physical vapor deposition (PVD) target having low friction pads

Patent metadata

Field	Value
Publication number	US-9960021-B2
Application number	US-201414182831-A
Country	US
Kind code	B2
Filing date	Feb 18, 2014
Priority date	Dec 18, 2013
Publication date	May 1, 2018
Grant date	May 1, 2018

Abstract

Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.

First claim

The invention claimed is:

1. A target assembly for a substrate processing chamber, comprising:
a plate comprising a first side including a central portion and a support portion, wherein the central portion is configured to support target source material; a plurality of recesses formed in the support portion; and
a plurality of pads partially disposed in the plurality of recesses, wherein each of the plurality of pads is secured to the support portion via a fastener disposed through the pad, wherein each of the plurality of pads includes a bearing surface, a countersunk recess having a first diameter that extends partially into a body of the pad, and a through hole having a second diameter that is smaller than the first diameter, and wherein a head of the fastener is disposed within the countersunk recess of the pad below the bearing surface.

2. The target assembly of claim 1 , wherein the plurality of recesses are circumferentially spaced around the plate.

3. The target assembly of claim 1 , wherein the plurality of recesses are similarly sized.

4. The target assembly of claim 1 , wherein the fastener is disposed in the countersunk recess and through hole.

5. The target assembly of claim 4 , wherein a shaft of the fastener is disposed through the through hole to secure the pad to the plate.

6. The target assembly of claim 1 , wherein each of the plurality of pads comprise a seating surface and a bearing surface, wherein, when the seating surface is supported on a bottom surface of a recess, the bearing surface is spaced above the first side of the plate.

7. The target assembly of claim 6 , wherein the bearing surface is spaced about 0.05 mm to about 1 mm above the first side.

8. The target assembly of claim 1 , wherein the plate includes a groove separating the support portion into an atmospheric side radially outward from the groove and a vacuum side radially inward from the groove.

9. The target assembly of claim 8 , wherein the plurality of recesses are formed in the atmospheric side.

10. The target assembly of claim 1 , wherein the plurality of pads are replaceable pads.

11. The target assembly of claim 1 , wherein the plurality of pads are formed from one or more of ultra-high-molecular-weight polyethylene or polyether ether ketone.

12. A target assembly for a substrate processing chamber, comprising:
a plate comprising a first side including a central portion and a support portion, wherein the central portion is configured to support target source material;
a groove formed in the plate separating the support portion into an atmospheric side radially outward from the groove and a vacuum side radially inward from the groove;
a plurality of recesses formed in the atmospheric side of the support portion and circumferentially spaced about the plate; and
a plurality of friction reducing pads partially disposed in the plurality of recesses such that a bearing surface is spaced above the first side of the plate, wherein each of the plurality of friction reducing pads is secured to the support portion via a fastener disposed through the pad, wherein each of the plurality of friction reducing pads includes a bearing surface, a countersunk recess having a first diameter that extends partially into a body of the pad, and a through hole having a second diameter that is smaller than the first diameter, and wherein a head of the fastener is disposed within the countersunk recess of the pad below the bearing surface.

13. The target assembly of claim 12 , wherein the groove is configured to retain a sealing element to facilitate formation of a seal between the atmospheric side and vacuum side.

Assignees

• Applied Materials Inc

Inventors

• Riker Martin Lee
• Pai Uday
• Fruchterman William
• Miller Keith A
• Rasheed Muhammad M
• Nguyen Thanh X
• Savandaiah Kirankumar

Classifications

• H01J37/3423 Primary

  Shape · CPC title

• H01J37/3435

  Target holders (includes backing plates and endblocks) · CPC title

• H01J37/3411

  Constructional aspects of the reactor · CPC title

• H01J37/3414 Primary

  Targets · CPC title

• C23C14/3407

  Cathode assembly for sputtering apparatus, e.g. Target · CPC title