Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
US-2020095699-A1 · Mar 26, 2020 · US
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Ishii Masafumi patents
Ishii Masafumi is listed as an inventor on 11 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ishii Masafumi |
| Total patents | 11 |
| First publication | Jun 23, 2016 |
| Latest publication | Mar 26, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Negative electrode current collector for secondary battery
US-2020036010-A1 · Jan 30, 2020 · US
Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
US-10519558-B2 · Dec 31, 2019 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-10178775-B2 · Jan 8, 2019 · US
Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
US-2018312989-A1 · Nov 1, 2018 · US
Copper sulfate, copper sulfate solution, plating solution, method for producing copper sulfate, method for producing semiconductor circuit board, and method for producing electronic apparatus
US-2018282891-A1 · Oct 4, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2018279482-A1 · Sep 27, 2018 · US
Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board
US-2018264783-A1 · Sep 20, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-9955583-B2 · Apr 24, 2018 · US
Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board
US-2016212857-A1 · Jul 21, 2016 · US
Recent patents
Latest publications not already listed above.
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jx Nippon Mining & Metals Corp | 11 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D3/38 | 11 |
| C25D1/04 | 7 |
| C25D7/0614 | 7 |
| H05K3/384 | 6 |
| C25D5/18 | 6 |