Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2018279482-A1 · Sep 27, 2018 · US
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Patent family 53186921
This patent family groups 3 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 53186921 |
| Family type | — |
| Earliest priority | Jul 23, 2013 |
| First filing country | US |
| Member publications | 3 |
| Countries | US |
| Representative publication | US2018279482A1 — Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board |
Representative publication
Best representative member for this family based on priority and filing country.
US2018279482A1 — Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board (published Sep 27, 2018)
Member publications
Related publications in this family.
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-9955583-B2 · Apr 24, 2018 · US
Surface-treated copper foil, copper foil with carrier, substrate, resin substrate, printed wiring board, copper clad laminate and method for producing printed wiring board
US-2016183380-A1 · Jun 23, 2016 · US