Substrate processing apparatus and substrate detaching method

Patent metadata

Field	Value
Publication number	US-9831112-B2
Application number	US-201414534246-A
Country	US
Kind code	B2
Filing date	Nov 6, 2014
Priority date	Nov 13, 2013
Publication date	Nov 28, 2017
Grant date	Nov 28, 2017

Abstract

A substrate processing apparatus includes an electrostatic chuck that includes a chuck electrode and electrostatically attracts a substrate; a direct voltage source that is connected to the chuck electrode and applies a voltage to the chuck electrode; and an evacuation unit that includes a rotor and discharges, via a heat transfer gas discharge pipe, a heat transfer gas supplied to a back surface of the substrate electrostatically-attracted by the electrostatic chuck. The evacuation unit is connected via a power supply line to the direct voltage source, generates regenerative power, and supplies the regenerative power to the direct voltage source.

First claim

What is claimed is:

1. A substrate processing apparatus, comprising:
an electrostatic chuck that includes a chuck electrode and electrostatically attracts a substrate;
an evacuation unit that includes a rotor and discharges, via a heat transfer gas discharge pipe, a heat transfer gas supplied to a back surface of the substrate electrostatically-attracted by the electrostatic chuck, and
a direct voltage source that is connected to the chuck electrode and the evacuation unit and applies a voltage to the chuck electrode and the evacuation unit;
wherein the evacuation unit is connected via a power supply line to the direct voltage source,
wherein the rotor is configured to convert rotational energy into regenerative power,
wherein the evacuation unit supplies the regenerative power to the electrostatic chuck and the evacuation unit through the direct voltage source when supply of power to the direct voltage source is stopped, and
wherein the substrate processing apparatus further comprises a processor that is configured to control the evacuation unit to supply the regenerative power to the electrostatic chuck and the evacuation unit through the direct voltage source when a power supply to the direct voltage source is unintentionally stopped.

2. The substrate processing apparatus as claimed in claim 1 , wherein the evacuation unit generates the regenerative power and supplies the regenerative power to the direct voltage source when the supply of power to the direct voltage source is stopped.

3. The substrate processing apparatus as claimed in claim 1 , further comprising:
a storage battery unit,
wherein the evacuation unit generates the regenerative power and supplies the regenerative power via the storage battery unit to the direct voltage source when supply of power to the direct voltage source is stopped.

4. The substrate processing apparatus as claimed in claim 1 , further comprising:
a gas discharge valve provided in the heat transfer gas discharge pipe,
wherein the evacuation unit discharges the heat transfer gas by adjusting the gas discharge valve.

5. The substrate processing apparatus as claimed in claim 1 , wherein the evacuation unit includes a turbo-molecular pump.

6. The substrate processing apparatus as claimed in claim 1 , wherein the evacuation unit supplies the regenerative power to both the electronic chuck and a evacuation valve of the evacuation unit through the direct voltage source.

7. The substrate processing apparatus as claimed in claim 1 , wherein the evacuation unit supplies the regenerative power to both the electronic chuck and a controller for controlling the electronic chuck through the direct voltage source.

8. The substrate processing apparatus as claimed in claim 1 ,
wherein the evacuation unit supplies the regenerative power to the evacuation unit after the evacuation unit supplies the regenerative power to the direct voltage source.

9. The substrate processing apparatus as claimed in claim 1 ,
wherein an attraction force of the electrostatic chuck is greater than a pressure of the heat transfer gas remaining under the back surface of the substrate when the evacuation unit supplies the regenerative power to the direct voltage source.

Assignees

• Tokyo Electron Ltd

Inventors

• Koiwa Shingo

Classifications

• H10P50/242

  of Group IV materials · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/78

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H10P72/722 Primary

  Details of electrostatic chucks · CPC title