Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
Cooling system for processing chamber
US2024393018A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2024393018-A1 |
| Application number | US-202418789469-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 30, 2024 |
| Priority date | Jan 31, 2019 |
| Publication date | Nov 28, 2024 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An apparatus is provided. The apparatus comprises a processing chamber. A substrate support is within the processing chamber, wherein the substrate support is in thermal contact with a substrate. A cooling system cools the substrate support. The cooling system comprises a first refrigeration system. The first refrigeration system comprises a first refrigerant inlet for receiving the first refrigerant from a first refrigerant source outside of the refrigeration system, wherein the first refrigerant is at a first pressure, a first throttle, wherein the first throttle allows a controlled expansion of the first refrigerant, wherein the expansion of the first refrigerant cools the first refrigerant, a first heat transfer system, for absorbing heat and transferring heat to the cooled first refrigerant, and a first refrigerant return for directing the first refrigerant from the first refrigeration system at a second pressure away from the first refrigeration system.
First claim
Opening claim text (preview).
What is claimed is: 1 . An apparatus, comprising a processing chamber; a substrate support within the processing chamber, wherein the substrate support is for thermal contact with a substrate; and a cooling system for cooling the substrate support, wherein the cooling system comprises: a first refrigeration system, comprising: a first refrigerant inlet for receiving a first refrigerant, wherein the first refrigerant is carbon dioxide, from a fabrication facility outside of…
Assignees
Inventors
Classifications
Electricity · mapped topic
- H10P72/0434Primary
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Patent family
Related publications grouped by family.
External sources
Next steps
Free tools are coming soon. Tell us what you want to track and we'll notify you.
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2024393018A1 cover?
- An apparatus is provided. The apparatus comprises a processing chamber. A substrate support is within the processing chamber, wherein the substrate support is in thermal contact with a substrate. A cooling system cools the substrate support. The cooling system comprises a first refrigeration system. The first refrigeration system comprises a first refrigerant inlet for receiving the first refri…
- Who is the assignee on this patent?
- Lam Res Corp
- What technology area does this patent fall under?
- Primary CPC classification H10P72/0434. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Nov 28 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).