Substrate processing apparatus, method for manufacturing semiconductor device, and recording medium

Patent metadata

Field	Value
Publication number	US-9816182-B2
Application number	US-201514608937-A
Country	US
Kind code	B2
Filing date	Jan 29, 2015
Priority date	Jul 30, 2012
Publication date	Nov 14, 2017
Grant date	Nov 14, 2017

Abstract

A substrate processing apparatus is disclosed. The substrate processing apparatus includes a process chamber configured to accommodate a substrate; a gas supply unit configured to supply a process gas into the process chamber; a lid member configured to block an end portion opening of the process chamber; an end portion heating unit installed around a side wall of an end portion of the process chamber; and a thermal conductor installed on a surface of the lid member in an inner side of the process chamber, and configured to be heated by the end portion heating unit.

First claim

What is claimed is:

1. A substrate processing apparatus comprising:
a process chamber configured to accommodate a plurality of substrates;
a substrate holding unit configured to hold the plurality of substrates accommodated in the process chamber;
a gas supply unit configured to supply a process gas into the process chamber;
a lid member configured to block an end portion opening of the process chamber;
a substrate heating unit configured to heat the plurality of substrates held by the substrate holding unit;
a heat insulator installed between the substrate holding unit and an end portion of the process chamber;
a lamp heater installed around a side wall of the end portion of the process chamber and surrounding a circumference of the process chamber, wherein the lamp heater is installed below a top portion of the heat insulator;
an O-ring installed between the lid member and the end portion of the process chamber;
a cooling passage installed around the end portion of the process chamber and surrounding the circumference of the process chamber, and installed below the lamp heater and above the O-ring;
a thermal conductor, without a self-heating function, installed on a surface of the lid member exposed within an inner space of the process chamber below the heat insulator such that the surface of the lid member is covered with the thermal conductor, the thermal conductor having a annular shape covering an area of the surface of the lid member along an inner circumference of the process chamber and made of a material having higher thermal conductivity than that of the lid member and configured to be heated directly with light radiated by the lamp heater; and
a control unit configured to control the lamp heater to heat the thermal conductor while the process gas is being supplied to the plurality of substrates from the gas supply unit.

2. The substrate processing apparatus of claim 1 , wherein the lamp heater is configured to heat the thermal conductor via the end portion of the process chamber consisting of a transparent member through which light transmits.

3. The substrate processing apparatus of claim 1 , wherein the control unit is configured to control the lamp heater such that a temperature of the lamp heater is maintained at a liquefaction prevention temperature at which the process gas is not liquefied.

4. The substrate processing apparatus of claim 3 , wherein the liquefaction prevention temperature is in a range from 50 degrees C. to 300 degrees C.

5. The substrate processing apparatus of claim 1 , wherein the thermal conductor includes thermal conductive ceramic or nonmetallic material coated with thermal conductive ceramic.

6. The substrate processing apparatus of claim 1 , wherein thermal conductivity of the thermal conductor is between 5 W/mK and 200 W/mK.

7. The substrate processing apparatus of claim 1 , wherein the thermal conductor has a porous structure.

8. The substrate processing apparatus of claim 1 , wherein the process gas is water vapor or a vaporized gas of hydrogen peroxide water.

9. A method of manufacturing a semiconductor device comprising:
providing a substrate processing apparatus that includes:
a process chamber configured to accommodate a plurality of substrates;
a substrate holding unit configured to hold the plurality of substrates accommodated in the process chamber;
a gas supply unit configured to supply a process gas into the process chamber;
a lid member configured to block an end portion opening of the process chamber;
a substrate heating unit configured to heat the plurality of substrates held by the substrate holding unit;
a heat insulator installed between the substrate holding unit and an end portion of the process chamber;
a lamp heater installed around a side wall of the end portion of the process chamber and surrounding a circumference of the process chamber, wherein the lamp heater is installed below a top portion of the heat insulator;
an O-ring installed between the lid member and the end portion of the process chamber;
a cooling passage installed around the end portion of the process chamber and surrounding the circumference of the process chamber, and installed below the lamp heater and above the O-ring; and
a thermal conductor, without a self-heating function, installed on a surface of the lid member exposed within an inner space of the process chamber below the heat insulator such that the surface of the lid member is covered with the thermal conductor, the thermal conductor having a annular shape covering an area of the surface of the lid member along an inner circumference of the process chamber and made of a material having higher thermal conductivity than that of the lid member and configured to be heated directly with light radiated by the lamp heater; and

heating the thermal conductor directly with light radiated by the lamp heater surrounding the circumference of the process chamber while the process gas is supplied to the substrate.

10. The method of claim 9 , wherein the act of heating the thermal conductor by the lamp heater comprises controlling the lamp heater such that a temperature of the lamp heater is maintained at a liquefaction prevention temperature at which the process gas is not liquefied.

Assignees

• Hitachi Int Electric Inc

Inventors

• Tateno Hideto
• Wada Yuichi
• Ashihara Hiroshi
• Yamazaki Keishin
• Ushida Takurou
• Nakamura Iwao
• Izumi Manabu

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0402 Primary

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P14/69215

  the material being a silicon oxide, e.g. SiO2 · CPC title