Blanket short channel roll-up implant with non-angled long channel compensating implant through patterned opening
US-9478615-B2 · Oct 25, 2016 · US
US9812550B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9812550-B2 |
| Application number | US-201715419315-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 30, 2017 |
| Priority date | Jun 27, 2012 |
| Publication date | Nov 7, 2017 |
| Grant date | Nov 7, 2017 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
A semiconductor structure includes first, second, and third transistor elements each having a first screening region concurrently formed therein. A second screening region is formed in the second and third transistor elements such that there is at least one characteristic of the screening region in the second transistor element that is different than the second screening region in the third transistor element. Different characteristics include doping concentration and depth of implant. In addition, a different characteristic may be achieved by concurrently implanting the second screening region in the second and third transistor element followed by implanting an additional dopant into the second screening region of the third transistor element.
Opening claim text (preview).
What is claimed is: 1. A method of fabricating a semiconductor structure, comprising: implanting in a substrate a first antipunchthrough region with a first doping concentration; implanting in the substrate a second antipunchthrough region with a second doping concentration; implanting in the substrate a screening region with a third doping concentration; forming a substantially undoped channel on the substrate; forming a gate on the substrate; implanting in the substrate a source and a drain; wherein the screening region is located to be below a surface of the substrate at a distance of at least less than 1.5 times a length of the gate and above a bottom of the source and drain to which the screening region abuts; wherein the first antipunchthrough region underlies the screening region and the first doping concentration is less than the third doping concentration; wherein the second antipunchthrough region underlies the first antipunchthrough region and the second doping concentration is less than the third doping concentration.
into semiconductor materials, e.g. for doping · CPC title
of conductive or resistive materials · CPC title
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Related publications grouped by family.
Answers are generated from the same data shown on this page.