Micromechanical component and corresponding test method for a micromechanical component

Patent metadata

Field	Value
Publication number	US-9764945-B2
Application number	US-201414471436-A
Country	US
Kind code	B2
Filing date	Aug 28, 2014
Priority date	Aug 28, 2013
Publication date	Sep 19, 2017
Grant date	Sep 19, 2017

Abstract

A micromechanical component and a corresponding test method for a micromechanical component are described. The micromechanical component includes at least one first region, which is elastically connected to a second region via a spring device, a resistor element, which is situated in and/or on the spring device and is at least partially interruptible in the event of damage to the spring device, and a detection device, which is electrically connected to the resistor element, for detecting an interruption in the resistor element and for generating a corresponding detection signal.

First claim

What is claimed is:

1. A micromechanical component, comprising:
at least one first region, wherein the at least one first region includes at least one of a stationary region and an elastically deflectable drive region;
a second region, wherein the second region is an elastically deflectable mirror region;
a spring device via which the first region is connected elastically to the second region;
a resistor element situated at least one of in and on the spring device, the resistor element being at least partially interruptible in the event of damage to the spring device; and
a detection device electrically connected to the resistor element, for detecting an interruption in the resistor element, and for generating a corresponding detection signal.

2. The micromechanical component as recited in claim 1 , wherein the first region is a stationary region.

3. The micromechanical component as recited in claim 1 , wherein the first region is an elastically deflectable drive region.

4. The micromechanical component as recited in claim 1 , wherein the resistor element passes over the first region, so that the resistor element is also interruptible in the event of damage to the first region.

5. The micromechanical component as recited in claim 4 , wherein the resistor element meanders over the first region.

6. The micromechanical component as recited in claim 1 , wherein the resistor element is connected to the detection device via the first region.

7. The micromechanical component as recited in claim 1 , wherein the detection device performs a temperature detection via the resistor element.

8. The micromechanical component as recited in claim 1 , wherein the detection device is configured to carry out a detection of light intensity via the resistor element.

9. The micromechanical component as recited in claim 1 , wherein:
the spring device includes at least one of a first section and a second section,
the resistor element is formed differently in the first section and in the second section, and
the resistor element is wired to the detection device in such a way that the detection device supplies a first detection signal in the event of an interruption of the resistor element in the first section, and supplies a second detection signal, which is different from the first detection signal, in the event of an interruption in the resistor element in the second section.

10. The micromechanical component as recited in claim 1 , wherein the detection device transmits the detection signal wirelessly externally.

11. The micromechanical component as recited in claim 1 , wherein the detection device transmits the detection signal wirelessly to a cell phone.

12. A test method for a micromechanical component including at least one first region elastically connected to a second region via a spring device, comprising:
providing a resistor element situated at least one of in and on the spring device, the resistor element being interruptible in the event of damage to the spring device; and
performing an electrical detection of an interruption in the resistor element and generating a corresponding detection signal,
wherein the at least one first region includes at least one of a stationary region and an elastically deflectable drive region and the second region is an elastically deflectable mirror region.

13. The micromechanical component as recited in claim 1 , wherein the damage to the spring device includes cracking and/or breakage of the spring device.

14. The test method as recited in claim 12 , wherein the damage to the spring device includes cracking and/or breakage of the spring device.

15. The micromechanical component as recited in claim 1 , wherein the resistor element passes over the second region, so that the resistor element is also interruptible in the event of damage to the second region.

Assignees

• Bosch Gmbh Robert

Inventors

• Reiss Sebastian
• Armbruster Simon
• Grutzeck Helmut
• Muchow Joerg
• Njimonzie Frederic Njikam
• Baader Johannes
• Straub Rainer
• Heinzelmann Wolfgang

Classifications

• B81C99/005 Primary

  Test apparatus · CPC title

• B81B7/0019 Primary

  Protection against thermal alteration or destruction (B81B7/0083 takes precedence) · CPC title

• B81B2201/042

  Micromirrors, not used as optical switches · CPC title