Wafer level centrifuge for MEMS stiction detection and screening system and method

Patent metadata

Field	Value
Publication number	US-9651473-B2
Application number	US-201414222575-A
Country	US
Kind code	B2
Filing date	Mar 21, 2014
Priority date	Mar 26, 2013
Publication date	May 16, 2017
Grant date	May 16, 2017

Abstract

A wafer level centrifuge (WLC) system and method of testing MEMS devices using the system. The wafer level centrifuge (WLC) system can include a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system. The method can include applying a smooth and continuous acceleration profile to two or more MEMS wafers via the base centrifuge system. Each of the two or more MEMS wafers can have one or more MEMS devices formed thereon. The two or more MEMS wafers can be provided in two or more wafer holding cassettes configured on the cassette mounting hub. The method can also include identifying one or more target MEMS wafers, which can include identifying stiction in one or more MEMS devices on the one or more MEMS wafers.

First claim

What is claimed is:

1. A method for testing MEMS devices using a wafer level centrifuge (WLC) system comprising a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system, the method comprising:
inserting one or more MEMS wafers into one or more cassettes;
coupling the one or more cassettes to the cassette mounting hub;
applying a controlled acceleration profile to the one or more MEMS wafers via the base centrifuge system, wherein each of the one or more MEMS wafers having one or more MEMS devices formed thereon;
removing the one or more MEMS wafers from the one or more cassettes; and
determining if the one or more MEMS devices from the one or more MEMS wafers has physical problems;
wherein the one or more MEMS wafers and the one or more cassettes include two or more MEMS wafers and two or more cassettes configured in a precision balanced manner on the cassette mounting hub.

2. The method of claim 1 wherein each of the one or more MEMS wafers comprises a top or bond pad side, and wherein the one or more MEMS wafers and the one or more cassettes are configured such that the top side of each of the MEMS wafers faces the cassette mounting hub from within the one or more cassettes.

3. The method of claim 1 wherein the one or more cassettes are vertically mounted on the cassette mounting hub.

4. The method of claim 1 wherein the one or more cassettes are horizontally mounted on the cassette mounting hub.

5. A method for testing MEMS devices using a wafer level centrifuge (WLC) system comprising a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system, the method comprising:
inserting one or more MEMS wafers into one or more cassettes;
coupling the one or more cassettes to the cassette mounting hub;
applying a controlled acceleration profile to the one or more MEMS wafers via the base centrifuge system, wherein each of the one or more MEMS wafers having one or more MEMS devices formed thereon;
removing the one or more MEMS wafers from the one or more cassettes; and
determining if the one or more MEMS devices from the one or more MEMS wafers has physical problems,
wherein the physical problems comprise stiction problems, wherein moving parts in a MEMS wafer remain stuck.

6. A method for testing MEMS devices using a wafer level centrifuge (WLC) system comprising a base centrifuge system and a cassette mounting hub coupled to the base centrifuge system, the method comprising:
providing two or more MEMS wafers, each having one or more MEMS devices formed thereon;
configuring the two or more MEMS wafers within two or more wafer holding cassettes;
configuring the two or more wafer holding cassettes on the cassette mounting hub;
applying a controlled acceleration profile to the MEMS wafers via the base centrifuge system; and
identifying one or more target MEMS wafers that have physical problems as a result of testing.

7. The method of claim 6 wherein the configuring of the two or more MEMS wafers and the two or more wafer holding cassettes are configured in a precision balanced manner on the cassette mounting hub.

8. The method of claim 6 wherein the two or more MEMS wafers comprises two or four MEMS wafers.

9. The method of claim 6 wherein each of the two or more MEMS wafers comprises a top or bond pad side, and wherein the configuring of the two or more MEMS wafers and the two or more wafer holding cassettes are such that the top side of each of the MEMS wafers faces the cassette mounting hub from within the two or more wafer holding cassettes.

10. The method of claim 6 wherein the configuring of the two or more MEM wafers and the two or more wafer holding cassettes is such that the g-force from applying the acceleration profile is oriented in the +Z direction relative to the one or more MEMS devices of each of the one or more MEMS wafers.

11. The method of claim 6 wherein the identifying of the one or more target MEMS wafers comprises identifying stiction in one or more MEMS devices on the one or more MEMS wafers.

12. The method of claim 6 wherein the identifying of the one or more target MEMS wafers comprises using a chip probing process, a wafer probing process, or convention wafer probe production process to identify the one or more target MEMS wafers.

13. The method of claim 6 wherein providing the two or more MEMS wafers comprises providing two or four MEMS wafers, each of the two or four MEMS wafers having one or more MEMS devices formed thereon.

14. The method of claim 6 wherein each of the two or more wafer holding cassettes comprise 2-slot Titanium wafer cassettes with Delrin ribs.

15. The method of claim 6 wherein the two or more wafer holding cassettes are vertically mounted on the cassette mounting hub.

16. The method of claim 6 wherein the two or more wafer holding cassettes are horizontally mounted on the cassette mounting hub.

17. The method of claim 6 wherein the cassette mounting hub comprises a pinned dovetail central cassette mounting hub.

18. The method of claim 6 wherein the controlled acceleration profile includes a smooth acceleration profile, a continuous acceleration profile, a step-wise acceleration profile, or a pulsed acceleration profile.

Assignees

• Mcube Inc

Inventors

• Merrill Jr Raymond
• Jensen David Paul

Classifications

• G01N19/02 Primary

  Measuring coefficient of friction between materials {(testing of tyres G01M17/02; determinations of friction coefficient used in vehicle braking or traction control systems B60T8/172)} · CPC title

• B81C99/005 Primary

  Test apparatus · CPC title