Catalyst layer forming method, catalyst layer forming system, and recording medium

Patent metadata

Field	Value
Publication number	US-9761485-B2
Application number	US-201514796227-A
Country	US
Kind code	B2
Filing date	Jul 10, 2015
Priority date	Jul 14, 2014
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

A catalyst layer can be uniformly formed on an entire surface of a substrate and an entire inner surface of a recess. A catalyst layer forming method of forming the catalyst layer on the substrate includes a first supply processing of forming a substrate surface catalyst layer 22 A by supplying a catalyst liquid on the entire surface of the substrate 2 ; and a second supply processing of forming a recess inner surface catalyst layer 22 B by supplying the catalyst liquid to a central portion of the substrate 2 while rotating the substrate 2.

First claim

We claim:

1. A catalyst layer forming method of forming a catalyst layer on a substrate, comprising:
a preparation processing of preparing the substrate including a recess;
a first supply processing of forming a substrate surface catalyst layer by supplying a catalyst liquid including a catalyst on the substrate such that the catalyst liquid is diffused to an outer surface of the recess and only a part of an inner surface of the recess and by adsorbing the catalyst to the outer surface of the recess and only said part of the inner surface of the recess; and
a second supply processing of forming a recess inner surface catalyst layer by supplying the catalyst liquid to a central portion of the substrate while rotating the substrate and by adsorbing the catalyst to a remaining part of the inner surface of the recess on which the substrate surface catalyst layer has not been formed by the first supply processing.

2. The catalyst layer forming method of claim 1 ,
wherein in the first supply processing, the catalyst liquid is supplied through a nozzle while the substrate is rotated, and the nozzle is moved back and forth between above the central portion of the substrate and above a peripheral portion thereof.

3. The catalyst layer forming method of claim 1 ,
wherein in the first supply processing, the catalyst liquid is supplied through a spray nozzle to the outer surface of the recess and only said part of the inner surface of the recess of the substrate in a spray form.

4. The catalyst layer forming method of claim 1 ,
wherein in the second supply processing, the catalyst liquid is supplied through a nozzle, and the nozzle is slightly moved back and forth near above the central portion of the substrate.

5. The catalyst layer forming method of claim 1 ,
wherein in the second supply processing, the catalyst liquid is supplied through a nozzle, and the nozzle is stopped above the central portion of the substrate.

6. The catalyst layer forming method of claim 1 ,
wherein in the second supply processing, the catalyst liquid is supplied through a spray nozzle to the central portion of the substrate in a spray form.

7. A non-transitory computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a catalyst layer forming system to perform a catalyst layer forming method of forming a catalyst layer on a substrate,
wherein the catalyst layer forming method includes:
a preparation processing of preparing the substrate including a recess;
a first supply processing of forming a substrate surface catalyst layer by supplying a catalyst liquid including a catalyst on the substrate such that the catalyst liquid is diffused to an outer surface of the recess and only a part of an inner surface of the recess and by adsorbing the catalyst to the outer surface of the recess and only said part of the inner surface of the recess; and
a second supply processing of forming a recess inner surface catalyst layer by supplying the catalyst liquid to a central portion of the substrate while rotating the substrate and by adsorbing the catalyst to an a remaining part of the inner surface of the recess on which the substrate surface catalyst layer has not been formed by the first supply processing.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10P14/46

  using a liquid · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/033

  in openings in dielectrics · CPC title