Pre-treatment method of plating, plating system, and recording medium

Patent metadata

Field	Value
Publication number	US-2016013101-A1
Application number	US-201514790119-A
Country	US
Kind code	A1
Filing date	Jul 2, 2015
Priority date	Jul 9, 2014
Publication date	Jan 14, 2016
Grant date	—

Abstract

A pre-treatment method of plating can suppress a catalyst layer from being peeled off from a substrate. The pre-treatment method of forming the catalyst layer on the substrate includes forming the catalyst layer 22 by adsorbing a catalyst 22 a on the substrate 2; and forming a catalyst fixing layer 27 on the catalyst layer 22.

First claim

We claim:

1 . A pre-treatment method of plating, comprising:
preparing a substrate; forming a catalyst layer by adsorbing a catalyst on the substrate; and forming a catalyst fixing layer, which is configured to fix the catalyst to the substrate, on the catalyst layer.

2 . The pre-treatment method of claim 1 ,
wherein an average thickness of the catalyst fixing layer is set to be in a range in which at least an upper portion of the catalyst is exposed.

3 . The pre-treatment method of claim 1 ,
wherein an adhesion layer is previously formed on the substrate to be adjacent to the catalyst layer before the forming of the catalyst layer.

4 . The pre-treatment method of claim 3 ,
wherein the adhesion layer is configured as an adhesion layer formed of a silane coupling agent or an adhesion layer formed of a titanate agent, or configured as a stacked body including the adhesion layer formed of the silane coupling agent and the adhesion layer formed of the titanate agent.

5 . The pre-treatment method of claim 1 ,
wherein a barrier layer is previously formed on the substrate to be adjacent to the catalyst layer before the forming of the catalyst layer.

6 . The pre-treatment method of claim 1 , further comprising:
baking the catalyst fixing layer by heating the substrate after the forming of the catalyst fixing layer.

7 . The pre-treatment method of claim 6 , further comprising:
baking the catalyst layer by heating the substrate before the forming of the catalyst fixing layer.

8 . A plating system comprising:
a catalyst layer forming unit configured to form a catalyst layer by adsorbing a catalyst on a substrate; a catalyst fixing layer forming unit configured to form a catalyst fixing layer, which is configured to fix the catalyst to the substrate, on the catalyst layer; and a substrate transfer unit configured to transfer the substrate between the catalyst layer forming unit and the catalyst fixing layer forming unit.

9 . The plating system of claim 8 ,
wherein the catalyst fixing layer forming unit is configured to set an average thickness of the catalyst fixing layer to be in a range in which at least an upper portion of the catalyst is exposed.

10 . The plating system of claim 8 ,
wherein an adhesion layer forming unit configured to form an adhesion layer on the substrate is provided.

11 . The plating system of claim 8 ,
wherein a barrier layer forming unit configured to form a barrier layer on the substrate is provided.

12 . The plating system of claim 8 , further comprising:
a first heating unit configured to bake the catalyst fixing layer by heating the substrate.

13 . The plating system of claim 8 , further comprising:
a second heating unit configured to bake the catalyst layer by heating the substrate.

14 . A computer-readable recording medium having stored thereon computer-executable instructions that, in response to execution, cause a plating system to perform a pre-treatment method of plating,
wherein the pre-treatment method includes: preparing a substrate; forming a catalyst layer by adsorbing a catalyst on the substrate; and forming a catalyst fixing layer, which is configured to fix the catalyst to the substrate, on the catalyst layer.

Assignees

• Tokyo Electron Ltd

Inventors

• Inatomi Yuichiro
• Tanaka Takashi

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10W20/0261

  characterised by the filling method or the material of the conductive fill · CPC title

• H10W20/043

  for electroplating · CPC title

• H10W20/0526

  by thermal treatment thereof · CPC title

• H10W20/033

  in openings in dielectrics · CPC title