Copper foil for printed circuit
US-9580829-B2 · Feb 28, 2017 · US
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Arai Hideta patents
Arai Hideta holds 3 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 3 |
| Recent patents | 0 |
| First publication | Jun 2, 2015 |
| Latest publication | Feb 28, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Copper foil for printed circuit
US-9580829-B2 · Feb 28, 2017 · US
Liquid crystal polymer copper-clad laminate and copper foil used for said laminate
US-9060431-B2 · Jun 16, 2015 · US
Rolled copper or copper-alloy foil provided with roughened surface
US-9049795-B2 · Jun 2, 2015 · US
Top CPC classifications
Most common classification codes in this portfolio.
| CPC | Patents |
|---|---|
| C25D7/0614 | 3 |
| C25D3/38 | 3 |
| H05K1/09 | 3 |
| H05K3/384 | 3 |
| C25D5/605 | 3 |
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Chemistry & Metallurgy | 3 |
| Electricity | 3 |
| Cross-Sectional Technologies | 3 |
| Operations & Transport | 1 |