Method of fabricating a coplanar waveguide device including removal of spurious microwave modes via flip-chip crossover

US9455392B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9455392-B2
Application numberUS-201514610551-A
CountryUS
Kind codeB2
Filing dateJan 30, 2015
Priority dateMar 15, 2013
Publication dateSep 27, 2016
Grant dateSep 27, 2016

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of fabricating a coplanar waveguide (CPW) device, the method comprising: fabricating a qubit circuit chip; wherein fabricating the qubit circuit chip comprises: patterning a CPW structure; fabricating at least one qubit; and coupling the at least one qubit to the CPW structure; fabricating an add-on chip configured to remove spurious microwave modes from the qubit circuit chip; wherein fabricating the add-on chip comprises: defining a trench in a substrate, the trench matching an outline of the at least one qubit, wherein the trench comprises an opening; and metalizing the trench and the substrate; disposing the add-on chip on the qubit circuit chip such that the opening in the trench faces the qubit circuit chip; and wherein the patterning of the CPW structure comprises forming ground planes on the qubit circuit chip and wherein the ground planes are exposed by the opening. 2. The method of claim 1 , wherein the trench and substrate are metallized with niobium (Nb). 3. The method of claim 1 , wherein patterning the CPW structure further comprises: forming a resonator; forming a drive pad coupled to the resonator; and forming a qubit pocket coupled to the resonator.

Assignees

Inventors

Classifications

  • Electricity · mapped topic

  • Manufacturing lines with conductors on a substrate, e.g. strip lines, slot lines · CPC title

  • Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic · CPC title

  • Coplanar striplines [CPS] · CPC title

  • Coplanar lines · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9455392B2 cover?
A coplanar waveguide device includes a coplanar waveguide structure disposed on a substrate, at least one qubit coupled to the coplanar waveguide structure and an add-on chip having a metallized trench, and disposed over the substrate.
Who is the assignee on this patent?
IBM
What technology area does this patent fall under?
Primary CPC classification H01L39/2406. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).