Wafer processing method
US-2024395620-A1 · Nov 28, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/0442 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 1,751 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 86 |
| 2016 | 86 |
| 2017 | 94 |
| 2018 | 140 |
| 2019 | 201 |
| 2020 | 226 |
| 2021 | 207 |
| 2022 | 184 |
| 2023 | 166 |
| 2024 | 159 |
| 2025 | 165 |
| 2026 | 37 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Pickup apparatus and method of using the same
US-12142499-B2 · Nov 12, 2024 · US
Method of manufacturing semiconductor device
US-2024321638-A1 · Sep 26, 2024 · US
Semiconductor Manufacturing Device, Push-up Unit, and Method of Manufacturing Semiconductor Device
US-2024312825-A1 · Sep 19, 2024 · US
Method for manufacturing electronic device
US-2024258152-A1 · Aug 1, 2024 · US
Bonding method and bonding apparatus
US-11931995-B2 · Mar 19, 2024 · US
Method for manufacturing substrate with chips, and substrate processing device
US-2024079403-A1 · Mar 7, 2024 · US
Transfer apparatus for transferring electronic devices and changing their orientations
US-9218995-B2 · Dec 22, 2015 · US
Wafer processing method
US-2015357224-A1 · Dec 10, 2015 · US
Wafer processing method
US-2015357242-A1 · Dec 10, 2015 · US
Method of reducing residual contamination in singulated semiconductor die
US-2015357241-A1 · Dec 10, 2015 · US
Vacuum film formation method and laminate obtained by the method
US-9206505-B2 · Dec 8, 2015 · US
Thin glass elongated body
US-2015343735-A1 · Dec 3, 2015 · US
Roll
US-2015337439-A1 · Nov 26, 2015 · US
Tape release systems and methods for semiconductor dies
US-9196520-B1 · Nov 24, 2015 · US
Semiconductor die singulation method and apparatus
US-2015332969-A1 · Nov 19, 2015 · US
Wafer processing method
US-2015332928-A1 · Nov 19, 2015 · US
Tape for processing wafer, method for manufacturing tape for processing
US-9190309-B2 · Nov 17, 2015 · US
Flexible substrate, manufacturing method of display element, and manufacturing apparatus of display element
US-9178155-B2 · Nov 3, 2015 · US
Wafer processing method
US-2015303113-A1 · Oct 22, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/0442?
- CPC H10P72/0442 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P72/0442 (Electricity)?
- Our database includes 1,751 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/0442 growing?
- Publication counts under this code: 159 in 2024 vs 165 in 2025 (latest complete years).