Multiple bonding layers for thin-wafer handling

Patent metadata

Field	Value
Publication number	US-9263314-B2
Application number	US-201113198294-A
Country	US
Kind code	B2
Filing date	Aug 4, 2011
Priority date	Aug 6, 2010
Publication date	Feb 16, 2016
Grant date	Feb 16, 2016

Abstract

Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

First claim

We claim:

1. A temporary bonding method comprising:
providing a stack comprising:
a first substrate having a back surface and a device surface;
a cleaning layer adjacent said device surface;
a first layer adjacent said cleaning layer, said first layer being selected from the group consisting of bonding layers and rigid layers; and
a second substrate having a carrier surface, said first layer being adjacent said carrier surface, said first layer being between said cleaning layer and said second substrate;

separating said first and second substrates; and
contacting said cleaning layer with a remover solution so as to substantially remove said cleaning layer and any first layer residue remaining after said separating.

2. The method of claim 1 , further comprising a second bonding layer between said first layer and said carrier surface.

3. The method of claim 2 , wherein said contacting substantially removes said second bonding layer.

4. The method of claim 1 , wherein said separating comprises heating said stack to a temperature sufficiently high so as to soften said first layer sufficiently to allow said first and second substrates to be separated.

5. The method of claim 2 , wherein said separating comprises heating said stack to a temperature sufficiently high so as to soften said second bonding layer sufficiently to allow said first and second substrates to be separated.

Assignees

• Puligadda Rama
• Zhong Xing-Fu
• Flaim Tony D
• Mccutcheon Jeremy
• Brewer Science Inc

Inventors

• Puligadda Rama
• Zhong Xing-Fu
• Flaim Tony D
• Mccutcheon Jeremy

Classifications

• H10P72/7448

  the bond interface between the auxiliary support and the wafer comprising two or more, e.g. multilayer adhesive or adhesive and release layer · CPC title

• Y10T156/11

  Methods of delaminating, per se; i.e. , separating at bonding face · CPC title

• Y10T428/31938

  Polymer of monoethylenically unsaturated hydrocarbon · CPC title

• Y10T428/31725

  Of polyamide · CPC title

• Y10T428/24942

  including components having same physical characteristic in differing degree · CPC title